2023 IEEE International Reliability Physics Symposium (IRPS) Proceedings

Book title Buchtitel

ISBN

978-1-6654-5672-2

DOI

10.1109/IRPS48203.2023

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		Preview	Author(s)	Title	Type	Issue Date
	1		Saleh, Ahmed S. ; Zahedmanesh, Houman ; Ceric, Hajdin ; De Wolf, Ingrid ; Croes, Kristof	Impact of via geometry and line extension on via-electromigration in nano-interconnects	Inproceedings Konferenzbeitrag	2023