Record link: 
http://hdl.handle.net/20.500.12708/188156
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Title: 
Statistical Study of Electromigration in Gold Interconnects
en
Citation: 
Ceric, H., Lacerda de Orio, R., & Selberherr, S. (2023). Statistical Study of Electromigration in Gold Interconnects. Microelectronics Reliability, 147, 1–7. https://doi.org/10.1016/j.microrel.2023.115061
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Publisher DOI: 
10.1016/j.microrel.2023.115061
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Publication Type: 
Article - Original Research Article
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Language: 
English
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Authors: 
Ceric, Hajdin 
Lacerda de Orio, Roberto 
Selberherr, Siegfried 
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Organisational Unit: 
E360 - Institut für Mikroelektronik 
E360-01 - Forschungsbereich Mikroelektronik 
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Journal: 
Microelectronics Reliability 
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ISSN: 
0026-2714
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Date (published): 
Aug-2023
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Number of Pages: 
7
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Publisher: 
PERGAMON-ELSEVIER SCIENCE LTD
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Peer reviewed: 
Yes
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Keywords: 
electromigration; gold interconnects; microstructure; failure statistics
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Research Areas: 
Metallic Materials: 25%
Nanoelectronics: 25%
Modeling and Simulation: 50%
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Science Branch: 
2020 - Elektrotechnik, Elektronik, Informationstechnik: 100%
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