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Schindler, G.

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		Preview	Author(s)	Title	Type	Issue Date
	1		Steinlesberger, Gernot ; Engelhardt, C.M. ; Schindler, G. ; Steinhögl, W. ; Grasow, A. von ; Mosig, K. ; Bertagnolli, Emmerich	Electrical Assessment of Copper Damascene Interconnects Down to sub 50 nm Feature Sizes	Präsentation Presentation	2002
	2		Steinlesberger, Gernot ; Steinhögl, W. ; Schindler, G. ; Engelhardt, C.M. ; Traving, M. ; Bertagnolli, Emmerich	Microsturcture Study of Cu Damascene Nano-Interconnects	Präsentation Presentation	2002
	3		Schindler, G. ; Steinhögl, W. ; Steinlesberger, Gernot ; Traving, M. ; Engelhardt, C.M.	Recent Advances for Nano Interconnects:Conductor Reliability and Resistivity	Präsentation Presentation	2002
	4		Steinhögl, W. ; Schindler, G. ; Steinlesberger, Gernot ; Traving, M. ; Engelhardt, C.M.	Surfce and Grain Boundary Scattering: A Modelling Study of Effects Domainating the Electrical Resistivity in sub-50nm Copper Lines	Präsentation Presentation	2002
	5		Engelhardt, C.M. ; Schindler, G. ; Steinhögl, W. ; Steinlesberger, Gernot	Challenges of Interconnection Technology Till the End of the Roadmap and Beyond	Präsentation Presentation	2002
	6		Traving, M. ; Schindler, G. ; Steinlesberger, Gernot ; Steinhögl, W. ; Engelhardt, C.M.	On The Way to the 2.5 nm Barrier For End-of-Roadmap MPUs	Präsentation Presentation	2002