ISSE 2023 - 46th International Spring Seminar on Electronics Technology "Revolutionizing the Electronic Ecosystems - Chiplet and Heterogeneous Inegration"

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Book details Buch-Details

Book title Buchtitel
ISSE 2023 - 46th International Spring Seminar on Electronics Technology "Revolutionizing the Electronic Ecosystems - Chiplet and Heterogeneous Inegration"
 
ISBN
978-606-35-0528-7
 
Editor Herausgeber_in
 
Publisher Herausgeber
Editura Politehnica
 
Place of publishing Erscheinungsort
Timisoara
 

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1Wodak, Irina ; Yakymovych, Andriy ; Khatibi Damavandi, Golta Hybrid Solder Joints: Morphology and Mechanical Properties of lead-free Sn-3.0Ag-0.5Cu Solders prepared with Fe-NPs doped FluxInproceedings Konferenzbeitrag6-Jul-2023