Record link: 
http://hdl.handle.net/20.500.12708/191270
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Title: 
Hybrid Solder Joints: Morphology and Mechanical Properties of lead-free Sn-3.0Ag-0.5Cu Solders prepared with Fe-NPs doped Flux
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Citation: 
Wodak, I., Yakymovych, A., & Khatibi Damavandi, G. (2023). Hybrid Solder Joints: Morphology and Mechanical Properties of lead-free Sn-3.0Ag-0.5Cu Solders prepared with Fe-NPs doped Flux. In B. Mihailescu, C. Marghescu, & H. Wohlrabe (Eds.), ISSE 2023 - 46th International Spring Seminar on Electronics Technology “Revolutionizing the Electronic Ecosystems - Chiplet and Heterogeneous Inegration” (pp. 148–149). Editura Politehnica.
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Publication Type: 
Inproceedings - Abstract Book Contribution
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Language: 
English
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Authors: 
Wodak, Irina 
Yakymovych, Andriy 
Khatibi Damavandi, Golta 
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Organisational Unit: 
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit 
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Published in: 
ISSE 2023 - 46th International Spring Seminar on Electronics Technology "Revolutionizing the Electronic Ecosystems - Chiplet and Heterogeneous Inegration" 
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ISBN: 
978-606-35-0528-7
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Date (published): 
6-Jul-2023
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Event name: 
46th International Spring Seminar on Electronics Technology : ISSE 2023 
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Event date: 
10-May-2023 - 14-May-2023
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Event place: 
Timisoara, Romania
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Number of Pages: 
2
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Publisher: 
Editura Politehnica, Timisoara
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Keywords: 
hybrid solder joints; nanoparticles; composites
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Project title: 
Hybrid-Lötstellen - neue vielversprechende Lötstrategie: P 34894-N (FWF - Österr. Wissenschaftsfonds) 
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Research Areas: 
Materials Characterization: 25%
Surfaces and Interfaces: 50%
Structure-Property Relationsship: 25%
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Science Branch: 
1040 - Chemie: 100%
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Appears in Collections:
Conference Paper

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