| | Preview | Author(s) | Title | Type | Issue Date |
| 1 |  | Hartleb, Moritz ; Imrich, Peter ; Zechner, Johannes ; Walter, Thomas ; Petersmann, Manuel ; Khatibi Damavandi, Golta | Adhesion properties of polyimide coated stacks: An in-depth analysis of the cross-sectional nanoindentation method | Article Artikel  | 30-Dec-2024 |
| 2 | | Lederer, Martin ; Khatibi Damavandi, Golta | Overview on Fracture Mechanics Topics | Presentation Vortrag | 3-Oct-2024 |
| 3 |  | Khodabakhshi, Farzad ; Wodak, Irina ; Yakymovych, Andriy ; Taheriniya, Shabnam ; Khademorezaian, Saba ; Wilde, Gerhard ; Khatibi Damavandi, Golta | Nano-scale mechanistic model for microstructural reliability in reactive hybrid solder joints | Article Artikel  | Oct-2024 |
| 4 | | Lederer, Martin | A generalized formulation of first strain gradient elasticity | Presentation Vortrag | 3-Sep-2024 |
| 5 | | Wodak, Irina ; Khodabakhshi, Farzad ; Yakymovych, Andriy ; Khatibi Damavandi, Golta | Interfacial reactions and microstructural evolution of Sn-based solder joints prepared with reactive Fe nanoparticles | Inproceedings Konferenzbeitrag | Jul-2024 |
| 6 | | Khatibi Damavandi, Golta | Innovative testing techniques for bond-wire fatigue in power electronic components | Presentation Vortrag | 23-May-2024 |
| 7 | | Khodabakhshi, Farzad ; Wodak, Irina ; Yakymovych, Andriy ; Wilde, Gerhard ; Khatibi Damavandi, Golta | Interaction of reactive Fe-nanoparticles with the intermetallic compounds (IMC) layer during reflow soldering solidification | Presentation Vortrag | 19-Mar-2024 |
| 8 |  | Felke, Florens ; Groth, Anne ; Hempel, Martin ; Czerny, Bernhard ; Khatibi Damavandi, Golta ; Döhler, Torsten ; Geißler, Ute | Effect of the loop forming process on the lifetime of aluminum heavy wire bonds under accelerated mechanical testing | Article Artikel  | Mar-2024 |
| 9 | | Wodak, Irina ; Khatibi, Golta ; Yakymovych, Andriy ; Krammer, Oliver ; Géczy, Attila | Iron Nanoparticle-Doped Flux: Wetting Characteristics of Flux and SAC305 Solder and Effects on Flux Viscosity | Inproceedings Konferenzbeitrag  | 2024 |
| 10 | | Wodak, Irina ; Géczy, Attila ; Krammer, Oliver ; Khatibi, Golta ; Yakymovych, Andriy ; Khodabakhshi, Farzad ; Tafferner, Zoltán | Impact of Fe-NPs doped flux on electromigration in Sn-based solder joints of chip-sized SMD components at lower Joule heating | Inproceedings Konferenzbeitrag | 2024 |
| 11 | | Walter, Thomas ; Czerny, Bernhard ; Khatibi Damavandi, Golta | A rapid reliability assessment method for fine wire bonds in power electronic packages | Inproceedings Konferenzbeitrag | 2024 |
| 12 | | Hartleb, Moritz ; Imrich, Peter ; Zechner, Johannes ; Walter, Thomas ; Khatibi, Golta | Adhesion measurements of Polyimide to silicon nitride for semiconductor component applications | Inproceedings Konferenzbeitrag  | 2024 |
| 13 | | Yakymovych, Andriy ; Wodak, Irina ; Khatibi Damavandi, Golta | Iron nanoparticle-doped flux: temperature-dependent density and viscosity of nanofluid with minor additions of Fe nanoparticles | Inproceedings Konferenzbeitrag | 2024 |
| 14 | | Yakymovych, Andriy ; Wodak, Irina ; Khodabakhshi, Farzad ; Flandorfer, Hans ; Fischer, Lukas ; Khatibi Damavandi, Golta | Hybrid solder joints: Thermodynamic and Calorimetric Studies of the Sn-based Fe-Sn(SAC305) alloys | Inproceedings Konferenzbeitrag | 2024 |
| 15 | | Khodabakhshi, Farzad ; Kampel, Irina ; Yakymovych, Andriy ; Wilde, Gerhard ; Khatibi Damavandi, Golta | Atom probe tomography (APT) characterization of intermetallic compounds (IMC) layer after soldering | Presentation Vortrag | 2024 |
| 16 | | Walter, Thomas | Hochbeschleunigte Lebensdauerprüfung für elektronische Bauteile | Presentation Vortrag | 14-Nov-2023 |
| 17 |  | Walter, Thomas ; Khatibi, G. ; Betzwar Kotas, A. ; Kretschy, Nicole | In-situ delamination detection in multi-layered semiconductor packages | Article Artikel  | Nov-2023 |
| 18 |  | Wodak, Irina ; Yakymovych, Andriy ; Svec, Peter ; Orovcik, Lubomir ; Khatibi, Golta | Hybrid solder joints: the effect of nanosized ZrO₂ particles on morphology of as-reflowed and thermally aged Sn-3.5Ag solder joints | Article Artikel  | Nov-2023 |
| 19 | | Wodak, Irina ; Yakymovych, Andriy ; Khodabakhshi, Farzad ; Khatibi Damavandi, Golta | Microstructural Features and Mechanical Properties of Sn3.5Ag Solder Joints Produced with Fe- and Ni- Nanoparticle Doped Flux | Presentation Vortrag | 25-Oct-2023 |
| 20 | | Wodak, Irina ; Khatibi Damavandi, Golta ; Yakymovych, Andriy | Hybrid solder joints: Morphology and shear strength of Sn-3.5Ag solder joints with flux doped with ceramic nanoparticles | Presentation Vortrag | Oct-2023 |