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| | Preview | Author(s) | Title | Type | Issue Date |
| 1 | | Rauchenwald, Katharina ; Boubenicek, Romana ; Traxler, Elsa ; Vanessa Treml ; Konegger, Thomas | Porous SiOC microspheres obtained via photopolymerization-assisted solidification templating of emulsions | Article Artikel  | Mar-2026 |
| 2 | | Konegger, Thomas | Polymer-Derived Ceramics for Sustainable Chemical Conversion Processes | Presentation Vortrag | 15-Dec-2025 |
| 3 | | Rauchenwald, Katharina ; Föttinger, Karin ; Konegger, Thomas | Macropore-tailoring of SiOC by photopolymerization-assisted solidification templating for monolithic catalyst supports | Article Artikel | Dec-2025 |
| 4 | | Lederer, Martin ; Delshadmanesh, Mitra ; Khatibi Damavandi, Golta | Fatigue Notch Sensitivity of CoCr Alloys | Presentation Vortrag | 16-Oct-2025 |
| 5 | | Yakymovych, Andriy ; Flandorfer, Hans ; Kaptay, George ; Fischer, Lukas ; Wodak, Irina ; Khatibi Damavandi, Golta | Enthalpy effect adding Fe to liquid Sn: difference between bulk and nanosized Iron | Presentation Vortrag | Aug-2025 |
| 6 | | Yakymovych, Andriy ; Khrushchyk, Khrystyna ; Wodak, Irina ; Plevachuk, Yuriy ; Švec, Peter Sr. ; Švec, Peter ; Orovcik, Lubomir ; Khatibi Damavandi, Golta | Hybrid solder joints: the effect of nickel-coated nanosized zirconia particles on morphology of as-reflowed and thermally aged Sn-3.5Ag/Cu solder joints | Presentation Vortrag | Aug-2025 |
| 7 | | Yakymovych, Andriy ; Wodak, Irina ; Auinger, Michael ; Khodabakhshi, Farzad ; Khatibi Damavandi, Golta | Hybrid solder joints: thermodynamic description of the Cu–Fe–Sn system at the Cu-Sn side | Presentation Vortrag | Aug-2025 |
| 8 | | Yakymovych, Andriy ; Wodak, Irina ; Švec, Peter Sr. ; Švec, Peter ; Plevachuk, Yuriy ; Mitterer, Claudia ; Khatibi Damavandi, Golta | Hybrid solder joints: characterization of the core/shell Fe/oxide nanosized particles | Presentation Vortrag | 23-Jun-2025 |
| 9 |  | Yakymovych, Andriy ; Wodak, Irina ; Khatibi, Golta | Hybrid Solder Joints: Viscosity Studies of the Nanocomposite Flux with Fe Nanoparticle Additions | Article Artikel   | Jan-2025 |
| 10 | | Opitz, Alexander Karl ; Viernstein, Alexander ; Hauk, Raphael ; Stiefler, Sophie | Oxygen Ion Batteries: A Novel All-Solid-State Technology for Stationary Energy Storage | Inproceedings Konferenzbeitrag | 2025 |
| 11 | | Delshadmanesh, Mitra ; Lederer, Martin ; Khatibi, Golta | Fatigue Notch Sensitivity of High Entropy Alloy CoCrFeNiMn Tested Under Ultrasonic Loading Conditions | Inproceedings Konferenzbeitrag | 2025 |
| 12 |  | Yakymovych, A. ; Wodak, I. ; Moser, N. ; Khatibi, G. | Hybrid solder joints: DTA measurements of the Sn-based Fe–Sn/(Sn–Ag–Cu) alloys in bulk and nanocomposite form | Article Artikel | 2025 |
| 13 | | Plevachuk, Yu. ; Švec, P. ; Maťko, I. ; Janičkovič, D. ; Yakymovych, Andriy ; Gejdoš Janotova, I. ; Poverzhuk, V. | Electrical resistivity of multicomponent Sn–Bi–In–Zn–Cu–Ag alloys as materials for low-temperature lead-free solders | Article Artikel | 2025 |
| 14 |  | Hartleb, Moritz ; Imrich, Peter ; Zechner, Johannes ; Walter, Thomas ; Petersmann, Manuel ; Khatibi Damavandi, Golta | Adhesion properties of polyimide coated stacks: An in-depth analysis of the cross-sectional nanoindentation method | Article Artikel | 30-Dec-2024 |
| 15 | | Lederer, Martin ; Khatibi Damavandi, Golta | Overview on Fracture Mechanics Topics | Presentation Vortrag | 3-Oct-2024 |
| 16 |  | Khodabakhshi, Farzad ; Wodak, Irina ; Yakymovych, Andriy ; Taheriniya, Shabnam ; Khademorezaian, Saba ; Wilde, Gerhard ; Khatibi Damavandi, Golta | Nano-scale mechanistic model for microstructural reliability in reactive hybrid solder joints | Article Artikel | Oct-2024 |
| 17 | | Lederer, Martin | A generalized formulation of first strain gradient elasticity | Presentation Vortrag | 3-Sep-2024 |
| 18 | | Wodak, Irina ; Khodabakhshi, Farzad ; Yakymovych, Andriy ; Khatibi Damavandi, Golta | Interfacial reactions and microstructural evolution of Sn-based solder joints prepared with reactive Fe nanoparticles | Inproceedings Konferenzbeitrag | Jul-2024 |
| 19 | | Khatibi Damavandi, Golta | Innovative testing techniques for bond-wire fatigue in power electronic components | Presentation Vortrag | 23-May-2024 |
| 20 | | Khodabakhshi, Farzad ; Wodak, Irina ; Yakymovych, Andriy ; Wilde, Gerhard ; Khatibi Damavandi, Golta | Interaction of reactive Fe-nanoparticles with the intermetallic compounds (IMC) layer during reflow soldering solidification | Presentation Vortrag | 19-Mar-2024 |
| 21 | | Felke, Florens ; Groth, Anne ; Hempel, Martin ; Czerny, Bernhard ; Khatibi Damavandi, Golta ; Döhler, Torsten ; Geißler, Ute | Effect of the loop forming process on the lifetime of aluminum heavy wire bonds under accelerated mechanical testing | Article Artikel | Mar-2024 |
| 22 | | Wodak, Irina ; Khatibi, Golta ; Yakymovych, Andriy ; Krammer, Oliver ; Géczy, Attila | Iron Nanoparticle-Doped Flux: Wetting Characteristics of Flux and SAC305 Solder and Effects on Flux Viscosity | Inproceedings Konferenzbeitrag | 2024 |
| 23 | | Wodak, Irina ; Géczy, Attila ; Krammer, Oliver ; Khatibi, Golta ; Yakymovych, Andriy ; Khodabakhshi, Farzad ; Tafferner, Zoltán | Impact of Fe-NPs doped flux on electromigration in Sn-based solder joints of chip-sized SMD components at lower Joule heating | Inproceedings Konferenzbeitrag | 2024 |
| 24 | | Walter, Thomas ; Czerny, Bernhard ; Khatibi Damavandi, Golta | A rapid reliability assessment method for fine wire bonds in power electronic packages | Inproceedings Konferenzbeitrag | 2024 |
| 25 | | Hartleb, Moritz ; Imrich, Peter ; Zechner, Johannes ; Walter, Thomas ; Khatibi, Golta | Adhesion measurements of Polyimide to silicon nitride for semiconductor component applications | Inproceedings Konferenzbeitrag | 2024 |
| 26 | | Yakymovych, Andriy ; Wodak, Irina ; Khatibi Damavandi, Golta | Iron nanoparticle-doped flux: temperature-dependent density and viscosity of nanofluid with minor additions of Fe nanoparticles | Inproceedings Konferenzbeitrag | 2024 |
| 27 | | Yakymovych, Andriy ; Wodak, Irina ; Khodabakhshi, Farzad ; Flandorfer, Hans ; Fischer, Lukas ; Khatibi Damavandi, Golta | Hybrid solder joints: Thermodynamic and Calorimetric Studies of the Sn-based Fe-Sn(SAC305) alloys | Inproceedings Konferenzbeitrag | 2024 |
| 28 | | Khodabakhshi, Farzad ; Kampel, Irina ; Yakymovych, Andriy ; Wilde, Gerhard ; Khatibi Damavandi, Golta | Atom probe tomography (APT) characterization of intermetallic compounds (IMC) layer after soldering | Presentation Vortrag | 2024 |
| 29 | | Walter, Thomas | Hochbeschleunigte Lebensdauerprüfung für elektronische Bauteile | Presentation Vortrag | 14-Nov-2023 |
| 30 |  | Walter, Thomas ; Khatibi, G. ; Betzwar Kotas, A. ; Kretschy, Nicole | In-situ delamination detection in multi-layered semiconductor packages | Article Artikel | Nov-2023 |
| 31 |  | Wodak, Irina ; Yakymovych, Andriy ; Svec, Peter ; Orovcik, Lubomir ; Khatibi, Golta | Hybrid solder joints: the effect of nanosized ZrO₂ particles on morphology of as-reflowed and thermally aged Sn-3.5Ag solder joints | Article Artikel | Nov-2023 |
| 32 | | Wodak, Irina ; Yakymovych, Andriy ; Khodabakhshi, Farzad ; Khatibi Damavandi, Golta | Microstructural Features and Mechanical Properties of Sn3.5Ag Solder Joints Produced with Fe- and Ni- Nanoparticle Doped Flux | Presentation Vortrag | 25-Oct-2023 |
| 33 | | Wodak, Irina ; Khatibi Damavandi, Golta ; Yakymovych, Andriy | Hybrid solder joints: Morphology and shear strength of Sn-3.5Ag solder joints with flux doped with ceramic nanoparticles | Presentation Vortrag | Oct-2023 |
| 34 | | Khatibi Damavandi, Golta ; Czerny, Bernhard | Lebensdauerprognose von IGBT-Modulen in Rekordzeit mit BAMFIT-Bondtester | Special Contribution Spezialbeitrag | Oct-2023 |
| 35 | | Khodabakhshi, Farzad ; Khatibi Damavandi, Golta | Graphene and carbon nanotubes functionality in Sn-Ag-Cu solder alloy | Presentation Vortrag | 7-Sep-2023 |
| 36 | | Delshadmanesh, Mitra ; Lederer, Martin ; Frank, Johannes ; Khatibi Damavandi, Golta | Study of fatigue life and fatigue notch sensitivity of biocompatible Co-Cr alloy L605 | Inproceedings Konferenzbeitrag | Sep-2023 |
| 37 | | Khatibi Damavandi, Golta ; Walter, Thomas | Beschleunigte Prüfmethode für Lotverbindungen in der Elektronik | Special Contribution Spezialbeitrag | Sep-2023 |
| 38 | | Wodak, Irina ; Yakymovych, Andriy ; Khatibi, Golta | Hybrid Solder Joints: Morphology and Mechanical Properties of lead-free Sn-based Solders with nano-sized Fe doped Flux | Inproceedings Konferenzbeitrag | 6-Jul-2023 |
| 39 | | Wodak, Irina ; Yakymovych, Andriy ; Khatibi Damavandi, Golta | Hybrid Solder Joints: Morphology and Mechanical Properties of lead-free Sn-3.0Ag-0.5Cu Solders prepared with Fe-NPs doped Flux | Inproceedings Konferenzbeitrag | 6-Jul-2023 |
| 40 | | Hartleb, Moritz ; Imrich , Peter ; Zechner, Johannes ; Walter, Thomas ; Khatibi Damavandi, Golta | Cross-sectional Nanoindentation: Applicability for testing Polyimide adhesion in semiconductor components | Inproceedings Konferenzbeitrag | 6-Jul-2023 |
| 41 | | Walter, Thomas ; Khatibi Damavandi, Golta | In-situ Delaminationsmessung in Mehrlagenstrukturen der Elektronik | Inproceedings Konferenzbeitrag | Jun-2023 |
| 42 |  | Yakymovych, Andriy ; Shtablavyi, Ihor | Effect of Nanosized Ni Reinforcements on the Structure of the Sn-3.0Ag-0.5Cu Alloy in Liquid and After-Reflow Solid States | Article Artikel | Jun-2023 |
| 43 | | Khatibi Damavandi, Golta ; Czerny, Bernhard ; Walter, Thomas | Alternative POF-Based Accelerated Testing | Presentation Vortrag | 18-Apr-2023 |
| 44 | | Lederer, Martin ; Betzwar Kotas, Agnieszka Monika ; Khatibi, G. | Lifetime modeling of solder joints based on accelerated mechanical testing and Finite Element Analysis | Article Artikel | Mar-2023 |
| 45 | | Yakymovych, Andriy ; Goh, Yingxin ; Kamaruzzaman L.S. ; Wodak, Irina ; Khatibi Damavandi, Golta | Hybrid solder joints: Effects of Fe nanoparticle-doped flux on morphology and hardness of SAC305 solder joints | Inproceedings Konferenzbeitrag | 2023 |
| 46 |  | Plevachuk, Yuriy ; Švec, Peter Sr ; Švec, Peter ; Orovcik, Lubomir ; Bajana, Otto ; Yakymovych, Andriy ; Rud, Alexander | Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites | Article Artikel | 2023 |
| 47 | | Wodak, Irina ; Khodabakhshi, Farzad ; Yakymovych, Andriy ; Khatibi Damavandi, Golta | Microstructural Features and Crystallographic Texture of Sn3.5Ag Solder Joints Produced with Fe-Nanoparticle Doped Flux* | Inproceedings Konferenzbeitrag | 2023 |
| 48 |  | Zareghomsheh, Mohammad ; Khatibi, Golta | The Activation Energy of Strain Bursts during Nanoindentation Creep on Polyethylene | Article Artikel | 23-Dec-2022 |
| 49 | | Wodak, Irina ; Yakymovych, Andriy ; Strutz, Patricia ; Wimmer, C. ; Syrym, Yerbol ; Khatibi Damavandi, Golta | Hybrid solder joints: the effect of nano-sized Ni and ceramic admixtures on morphology and shear strength of Sn-5.0Ag solder joints | Inproceedings Konferenzbeitrag | Aug-2022 |
| 50 | | Lederer, Martin ; Gökdeniz, Zeynep Gökce ; Khatibi Damavandi, Golta ; Nicolics, Johann | Temperaturabhängigkeit mechanischer Eigenschaften von Niedertemperatur-Silber-Sinterschichten und deren Modellierung für die Nutzung in FiniteElemente-Simulationen | Inproceedings Konferenzbeitrag | Jun-2022 |
| 51 | | Khatibi Damavandi, Golta ; Czerny, Bernhard ; Walter, Thomas ; Lederer, Martin ; Betzwar Kotas, Agnieszka Monika ; Zareghomsheh, Mohammad | PoF Based Accelerated Testing | Presentation Vortrag | Jun-2022 |
| 52 | | Khatibi Damavandi, Golta | Reliability Assessment of Thin Films and Multilayers in Electronic Packages | Presentation Vortrag | 26-May-2022 |
| 53 | | Wodak, Irina ; Yakymovych, Andriy ; Khatibi Damavandi, Golta | Insights into synthesis of nanosized Ni and Fe particles by chemical reduction method | Presentation Vortrag | 4-May-2022 |
| 54 | | Wodak, Irina ; Yakymovych, Andriy ; Strutz P. ; Wimmer C. ; Yerbol S. ; Khatibi Damavandi, Golta | Hybrid solder joints: the effect of nano-sized Ni and ceramic admixtures on morphology and shear strength of Sn-5.0Ag solder joints | Presentation Vortrag | 4-May-2022 |
| 55 | | Yakymovych, Andriy ; Plevachuk, Yuriy ; Svec, P. ; Svec Sr. P. ; Sklyarchuk V. | Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites | Presentation Vortrag | 4-May-2022 |
| 56 | | Czerny, Bernhard ; Khatibi Damavandi, Golta | Highly accelerated lifetime testing in power electronics | Inproceedings Konferenzbeitrag | 2022 |
| 57 | | Betzwar Kotas, Agnieszka Monika ; Lederer, Martin ; Khatibi Damavandi, Golta ; Boczkal, Grzegorz ; Perek-Nowak M. | Mechanical Reliability of Lead-Free Solder Joints: Comparative Study of Sn3.5Ag versus SnSbAg Solder Alloy | Presentation Vortrag | 2022 |
| 58 | | Lederer, Martin ; Betzwar Kotas, Agnieszka Monika ; Khatibi Damavandi, Golta | Accelerated Fatigue Testing and Lifetime Modelling of Solder Interconnects in Power Electronics | Presentation Vortrag | 2022 |
| 59 | | Wodak, Irina ; Yakymovych, Andriy ; Khatibi Damavandi, Golta | Insight into synthesis of nanosized Ni and Fe particles by chemical reduction method | Inproceedings Konferenzbeitrag | 2022 |
| 60 | | Czerny, Bernhard ; Khatibi Damavandi, Golta | Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics | Article Artikel | 2022 |
| 61 | | Fernández-Canteli, Alfonso ; Castillo, Enrique ; Blasón, Sergio ; Khatibi Damavandi, Golta ; Czerny, Bernhard ; Zareghomsheh, Mohammad | Un modelo integral para describir la influencia de la frecuencia de ensayo sobre los resultados de fatiga | Article Artikel | 2022 |
| 62 | | Rafiee, Peyman ; Khatibi, Golta ; Solazzi, Francesco | Optically-detected nonlinear oscillations of single crystal silicon MEMS accelerometers | Article Artikel | 2022 |
| 63 | | Khatibi Damavandi, Golta ; Czerny, Bernhard | Mechanical lifetime testing of wire bonds vs power cycling | Presentation Vortrag | 2022 |
| 64 | | Lederer, Martin ; Walter, Thomas ; Khatibi, Golta | Modelling of Cyclic Delamination Behavior of Thin Multilayered Structures Using Gradient Elasticity and Damage Accumulation | Artikel Article | Jan-2021 |
| 65 | | Betzwar Kotas, Agnieszka Monika ; Khatibi, Golta ; Khodabakhshi, Farzad ; Steiger-Thirsfeld, Andreas | High Cycle Fatigue Behaviour of Cu/Sn Intermetallic Compounds Prepared by Transient Liquid Phase Bonding Process | Artikel Article | Jan-2021 |
| 66 | | Khatibi, Golta | Reliability and lifetime assessment in power electronics | Präsentation Presentation | 2021 |
| 67 | | Walter, Thomas ; Zareghomsheh, Mohammad ; Khatibi, Golta ; Popok, Vladimir ; Kristensen, Peter ; Schwarz, Sabine | Interfacial adhesion strength of III-N heterostructures | Präsentation Presentation | 2021 |
| 68 | | Walter, Thomas ; Zareghomsheh, Mohammad ; Khatibi, Golta ; Danninger, Herbert | Adhesion properties of thin film multilayers: Comparison of nanoindentation and four-point-bending techniques | Artikel Article | 2021 |
| 69 | | Castillo, Enrique ; Fernández-Canteli, Alfonso ; Blasón, Sergio ; Khatibi, Golta ; Czerny, Bernhard ; Zareghomsheh, Mohammad | Step-by-Step Building of a Four Dimensional Fatigue Compatible Regression Model including Frequencies | Artikel Article | 2021 |
| 70 | | Lederer, M ; Walter, T ; Zareghomsheh, M ; Khatibi, G | Delamination Criteria for SiN/TiW Interfaces Tested by Cross-Sectional Nanoidentation and by Four Point Bending | Konferenzbeitrag Inproceedings | 2021 |
| 71 | | Goekdeniz, Zeynep ; Lederer, Martin ; Khatibi, Golta ; Nicolics, Johann | Temperature Dependent Relaxation Behavior of Pressureless and Pressure Assisted Sintered Silver | Konferenzbeitrag Inproceedings | 2021 |
| 72 | | Goekdeniz, Zeynep ; Lederer, Martin ; Khatibi, Golta ; Nicolics, Johann | Temperature Dependent Relaxation Behavior of Ag-Sintered Copper Joints | Konferenzbeitrag Inproceedings | 2021 |
| 73 | | Czerny, Bernhard ; Khatibi Damavandi, Golta | Interface characterization of Cu Cu ball bonds by a fast shear fatigue method | Article Artikel | Nov-2020 |
| 74 | | Lederer, Martin ; Betzwar Kotas, Agnieszka Monika ; Khatibi Damavandi, Golta | A lifetime assessment and prediction method for large area solder joints | Article Artikel | Nov-2020 |
| 75 | | Aspalter, Anna ; Cerny, Angelika ; Goeschl, Michael ; Podsednik, Maximilian ; Khatibi, Golta ; Yakymovych, Andriy ; Plevachuk, Yuri | Hybrid solder joints: morphology and shear strength of Sn–3.0Ag–0.5Cu solder joints by adding ceramic nanoparticles through flux doping | Artikel Article | 23-Apr-2020 |
| 76 | | Khatibi, Golta ; Kirchgaßner, Martin | A method for evaluation of weld overlays exposed to combined wear and very high cycle fatigue conditions | Konferenzbeitrag Inproceedings | 2020 |
| 77 | | Lederer, Martin ; Kotas, Agnieszka Betwar ; Khatibi, Golta ; Danninger, Herbert | On crack propagation in homogeneous and composite materials under mixed mode loading conditions | Konferenzbeitrag Inproceedings | 2020 |
| 78 | | Lederer, Martin | Material Frame Indifferent Strain Gradient Elasticity: Theoretical formulation and mixed type Finite Element implementation | Konferenzbeitrag Inproceedings | 2020 |
| 79 | | Haddadi, Bahram ; Jordan, Christian ; Wedl, Günter ; Harasek, Michael ; Gasser, Christoph ; Lendl, Bernhard | Endbericht Projekt "LaserEye" | Bericht Report | 2020 |
| 80 | | Zareghomsheh, Mohammad ; Khatibi, Golta ; Weiss, Brigitte ; Lederer, Martin ; Schwarz, Sabine ; Steiger-Thirsfeld, Andreas ; Tikhonovsky, M. ; Tabachnikova, E.D. ; Schafler, Erhard | High cycle fatigue deformation mechanisms of a single phase CrMnFeCoNi high entropy alloy | Artikel Article | 2020 |
| 81 | | Gökdeniz, Z.G. ; Khatibi, Golta ; Gierl-Mayer, Christian ; Steiger-Thirsfeld, Andreas ; Mündlein, Martin | Temperature Dependent Physical Properties of Sintered Silver Layers for Power Electronics | Konferenzbeitrag Inproceedings | 2020 |
| 82 | | Gökdeniz, Z.G. ; Mündlein, Martin ; Khatibi, Golta ; Steiger-Thirsfeld, Andreas ; Nicolics, Johann | Ermüdungsverhalten hoch-belasteter Ag-Sinterverbindungen | Konferenzbeitrag Inproceedings | 2020 |
| 83 | | Czerny, Bernhard ; Khatibi, Golta ; Geißler, Ute | Loop formation effects on the lifetime of wire bonds for power electronics | Konferenzbeitrag Inproceedings | 2020 |
| 84 | | Sayyadi, R. ; Khodabakhshi, F. ; Javid, N. Shahamat ; Khatibi, G. | Influence of graphene content and nickel decoration on the microstructural and mechanical characteristics of the Cu/Sn-Ag-Cu/Cu soldered joint | Artikel Article | 2020 |
| 85 | | Khodabakhshi, Farzad ; Zareghomsheh, Mohammad ; Khatibi, Golta | Nanoindentation creep behavior of SAC-based lead-free nanocomposite solders reinforced by Ni-coated MW-CNTs | Artikel Article | 2020 |
| 86 | | Goekdeniz, Zeynep ; Khatibi, Golta ; Nicolics, Johann | Fatigue Behavior of Sintered Cu-Ag-Cu Lap-joints | Präsentation Presentation | 2019 |
| 87 | | Goekdeniz, Zeynep ; Khatibi, Golta ; Nicolics, Johann | Influence of Temperature on Mechanical Fatigue of Sintered Cu-Ag-Cu Joints | Präsentation Presentation | 2019 |
| 88 | | Goekdeniz, Zeynep ; Khatibi, Golta ; Nicolics, Johann | Fatigue behavior of Ag-sintered joints | Präsentation Presentation | 2019 |
| 89 | | Czerny, Bernhard | Wirebond reliability and accelerated mechanical testing | Präsentation Presentation | 2019 |
| 90 | | Czerny, Bernhard | Wirebond reliability and accelerated mechanical testing | Präsentation Presentation | 2019 |
| 91 | | Walter, Thomas | Methods for evaluation of thin film adhesion in power electronics | Präsentation Presentation | 2019 |
| 92 | | Khatibi, Golta | Alternative accelerated qualification methods for electronic components | Präsentation Presentation | 2019 |
| 93 | | Czerny, Bernhard | Wire bond reliability and accelerated mechanical testing | Präsentation Presentation | 2019 |
| 94 | | Betzwar Kotas, Agnieszka ; Khatibi, Golta | Mechanical properties of CuSn intermetallics under static and cyclic loading | Präsentation Presentation | 2019 |
| 95 | | Walter, Thomas ; Khatibi, Golta | Cyclic delamination behaviour of thin film multilayers | Präsentation Presentation | 2019 |
| 96 | | Boturchuk, Ievgen ; Walter, Thomas ; Julsgaard, Brian ; Khatibi, Golta ; Schwarz, Sabine ; Stöger-Pollach, Michael ; Pedersen, Kjeld ; Popok, Vladimir N. | Structure and properties of Ta/Al/Ta and Ti/Al/Ti/Au multilayer metal stacks formed as ohmic contacts on n-GaN | Artikel Article | 2019 |
| 97 | | Saghaeian, F. ; Lederer, M. ; Hofer, A. ; Todt, J. ; Keckes, J. ; Khatibi, G. | Investigation of high cyclic fatigue behaviour of thin copper films using MEMS structure | Artikel Article | 2019 |
| 98 | | Popok, V. N. ; Buhrkal-Donau, S. ; Czerny, B. ; Khatibi, G. ; Luo, H. ; Iannuzzo, F. ; Pedersen, K. B. | Comparative study of wire bond degradation under power and mechanical accelerated tests | Artikel Article | 2019 |
| 99 | | Gasser, Christoph ; Czerny, Bernhard ; Khatibi, Golta | Versatile ultrasonic fatigue testing method with variable load ratio for small scaled samples | Konferenzbeitrag Inproceedings | 2019 |
| 100 | | Geokdeniz, Zeynep ; Khatibi, Golta ; Nicolics, Johann ; Steiger-Thirsfeld, Andreas | Behaviour of Silver-Sintered Joints by Cyclic Mechanical Loading and Influence of Temperature | Konferenzbeitrag Inproceedings | 2019 |
