Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit

Organization Name (de) Name der Organisation (de)
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit
 
Code Kennzahl
E164-03-2
 
Type of Organization Organisationstyp
Research Group
Parent OrgUnit Übergeordnete Organisation
 
Active Aktiv
 


Results 1-20 of 144 (Search time: 0.003 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Hartleb-2024-Heliyon-vor.pdf.jpgHartleb, Moritz ; Imrich, Peter ; Zechner, Johannes ; Walter, Thomas ; Petersmann, Manuel ; Khatibi Damavandi, Golta Adhesion properties of polyimide coated stacks: An in-depth analysis of the cross-sectional nanoindentation methodArticle Artikel 30-Dec-2024
2Lederer, Martin ; Khatibi Damavandi, Golta Overview on Fracture Mechanics TopicsPresentation Vortrag3-Oct-2024
3Khodabakhshi-2024-Materials Characterization-vor.pdf.jpgKhodabakhshi, Farzad ; Wodak, Irina ; Yakymovych, Andriy ; Taheriniya, Shabnam ; Khademorezaian, Saba ; Wilde, Gerhard ; Khatibi Damavandi, Golta Nano-scale mechanistic model for microstructural reliability in reactive hybrid solder jointsArticle Artikel Oct-2024
4Lederer, Martin A generalized formulation of first strain gradient elasticityPresentation Vortrag3-Sep-2024
5Wodak, Irina ; Khodabakhshi, Farzad ; Yakymovych, Andriy ; Khatibi Damavandi, Golta Interfacial reactions and microstructural evolution of Sn-based solder joints prepared with reactive Fe nanoparticlesInproceedings KonferenzbeitragJul-2024
6Khatibi Damavandi, Golta Innovative testing techniques for bond-wire fatigue in power electronic componentsPresentation Vortrag23-May-2024
7Khodabakhshi, Farzad ; Wodak, Irina ; Yakymovych, Andriy ; Wilde, Gerhard ; Khatibi Damavandi, Golta Interaction of reactive Fe-nanoparticles with the intermetallic compounds (IMC) layer during reflow soldering solidificationPresentation Vortrag19-Mar-2024
8Felke-2024-Microelectronics Reliability-vor.pdf.jpgFelke, Florens ; Groth, Anne ; Hempel, Martin ; Czerny, Bernhard ; Khatibi Damavandi, Golta ; Döhler, Torsten ; Geißler, Ute Effect of the loop forming process on the lifetime of aluminum heavy wire bonds under accelerated mechanical testingArticle Artikel Mar-2024
9Wodak, Irina ; Khatibi, Golta ; Yakymovych, Andriy ; Krammer, Oliver ; Géczy, Attila Iron Nanoparticle-Doped Flux: Wetting Characteristics of Flux and SAC305 Solder and Effects on Flux ViscosityInproceedings Konferenzbeitrag 2024
10Wodak, Irina ; Géczy, Attila ; Krammer, Oliver ; Khatibi, Golta ; Yakymovych, Andriy ; Khodabakhshi, Farzad ; Tafferner, Zoltán Impact of Fe-NPs doped flux on electromigration in Sn-based solder joints of chip-sized SMD components at lower Joule heatingInproceedings Konferenzbeitrag2024
11Walter, Thomas ; Czerny, Bernhard ; Khatibi Damavandi, Golta A rapid reliability assessment method for fine wire bonds in power electronic packagesInproceedings Konferenzbeitrag2024
12Hartleb, Moritz ; Imrich, Peter ; Zechner, Johannes ; Walter, Thomas ; Khatibi, Golta Adhesion measurements of Polyimide to silicon nitride for semiconductor component applicationsInproceedings Konferenzbeitrag 2024
13Yakymovych, Andriy ; Wodak, Irina ; Khatibi Damavandi, Golta Iron nanoparticle-doped flux: temperature-dependent density and viscosity of nanofluid with minor additions of Fe nanoparticlesInproceedings Konferenzbeitrag2024
14Yakymovych, Andriy ; Wodak, Irina ; Khodabakhshi, Farzad ; Flandorfer, Hans ; Fischer, Lukas ; Khatibi Damavandi, Golta Hybrid solder joints: Thermodynamic and Calorimetric Studies of the Sn-based Fe-Sn(SAC305) alloysInproceedings Konferenzbeitrag2024
15Khodabakhshi, Farzad ; Kampel, Irina ; Yakymovych, Andriy ; Wilde, Gerhard ; Khatibi Damavandi, Golta Atom probe tomography (APT) characterization of intermetallic compounds (IMC) layer after solderingPresentation Vortrag2024
16Walter, Thomas Hochbeschleunigte Lebensdauerprüfung für elektronische BauteilePresentation Vortrag14-Nov-2023
17Walter-2023-Microelectronics Reliability-vor.pdf.jpgWalter, Thomas ; Khatibi, G. ; Betzwar Kotas, A. ; Kretschy, Nicole In-situ delamination detection in multi-layered semiconductor packagesArticle Artikel Nov-2023
18Wodak-2023-Applied Nanoscience-vor.pdf.jpgWodak, Irina ; Yakymovych, Andriy ; Svec, Peter ; Orovcik, Lubomir ; Khatibi, Golta Hybrid solder joints: the effect of nanosized ZrO₂ particles on morphology of as-reflowed and thermally aged Sn-3.5Ag solder jointsArticle Artikel Nov-2023
19Wodak, Irina ; Yakymovych, Andriy ; Khodabakhshi, Farzad ; Khatibi Damavandi, Golta Microstructural Features and Mechanical Properties of Sn3.5Ag Solder Joints Produced with Fe- and Ni- Nanoparticle Doped FluxPresentation Vortrag25-Oct-2023
20Wodak, Irina ; Khatibi Damavandi, Golta ; Yakymovych, Andriy Hybrid solder joints: Morphology and shear strength of Sn-3.5Ag solder joints with flux doped with ceramic nanoparticlesPresentation VortragOct-2023