Record link: 
http://hdl.handle.net/20.500.12708/209890
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Title: 
Impact of Fe-NPs doped flux on electromigration in Sn-based solder joints of chip-sized SMD components at lower Joule heating
en
Citation: 
Wodak, I., Géczy, A., Krammer, O., Khatibi, G., Yakymovych, A., Khodabakhshi, F., & Tafferner, Z. (2024). Impact of Fe-NPs doped flux on electromigration in Sn-based solder joints of chip-sized SMD components at lower Joule heating. In 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME)ME) (pp. 370–373). https://doi.org/10.1109/SIITME63973.2024.10814758
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Publisher DOI: 
10.1109/SIITME63973.2024.10814758
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Publication Type: 
Inproceedings - Full-Paper Contribution
en
Language: 
English
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Authors: 
Wodak, Irina 
Géczy, Attila 
Krammer, Oliver 
Khatibi, Golta 
Yakymovych, Andriy 
Khodabakhshi, Farzad 
Tafferner, Zoltán 
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Organisational Unit: 
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit 
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Published in: 
2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME)ME) 
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ISBN: 
979-8-3315-3951-1
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DOI of the book: 
10.1109/SIITME63973.2024
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Date (published): 
2024
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Event name: 
2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME) 
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Event date: 
16-Oct-2024 - 18-Oct-2024
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Event place: 
Sibiu, Romania
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Number of Pages: 
4
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Keywords: 
Electromigration; Chip-size components; Fe Nanoparticles
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Project title: 
Hybrid-Lötstellen - neue vielversprechende Lötstrategie: P 34894-N (FWF - Österr. Wissenschaftsfonds) 
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Research Areas: 
Special and Engineering Materials: 50%
Surfaces and Interfaces: 25%
Structure-Property Relationsship: 25%
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Science Branch: 
1040 - Chemie: 50%
2020 - Elektrotechnik, Elektronik, Informationstechnik: 50%
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Appears in Collections:
Conference Paper

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