2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME)ME)

Book title Buchtitel

ISBN

979-8-3315-3951-1

DOI

10.1109/SIITME63973.2024

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		Preview	Author(s)	Title	Type	Issue Date
	1		Wodak, Irina ; Géczy, Attila ; Krammer, Oliver ; Khatibi, Golta ; Yakymovych, Andriy ; Khodabakhshi, Farzad ; Tafferner, Zoltán	Impact of Fe-NPs doped flux on electromigration in Sn-based solder joints of chip-sized SMD components at lower Joule heating	Inproceedings Konferenzbeitrag	2024