2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME)

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Description

Event name
2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME)
 
Event type
Event for scientific audience
 
Start date
16-10-2024
End date
18-10-2024
 
Location
Sibiu
Country
Romania
 
Event format Veranstaltungsformat
On Site

Publications Publikationen

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PreviewAuthor(s)TitleTypeIssue Date
1Wodak, Irina ; Géczy, Attila ; Krammer, Oliver ; Khatibi, Golta ; Yakymovych, Andriy ; Khodabakhshi, Farzad ; Tafferner, Zoltán Impact of Fe-NPs doped flux on electromigration in Sn-based solder joints of chip-sized SMD components at lower Joule heatingInproceedings Konferenzbeitrag2024