Record link: 
http://hdl.handle.net/20.500.12708/209889
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Title: 
A rapid reliability assessment method for fine wire bonds in power electronic packages
en
Citation: 
Walter, T., Czerny, B., & Khatibi Damavandi, G. (2024). A rapid reliability assessment method for fine wire bonds in power electronic packages. In 2024 Austrochip Workshop on Microelectronics (Austrochip). 2024 Austrochip Workshop on Microelectronics (Austrochip), Austria. https://doi.org/10.1109/AUSTROCHIP62761.2024.10716214
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Publisher DOI: 
10.1109/AUSTROCHIP62761.2024.10716214
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Publication Type: 
Inproceedings - Full-Paper Contribution
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Language: 
English
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Authors: 
Walter, Thomas 
Czerny, Bernhard 
Khatibi Damavandi, Golta 
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Organisational Unit: 
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit 
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Published in: 
2024 Austrochip Workshop on Microelectronics (Austrochip) 
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ISBN: 
979-8-3315-1617-8
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DOI of the book: 
10.1109/Austrochip62761.2024
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Date (published): 
2024
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Event name: 
2024 Austrochip Workshop on Microelectronics (Austrochip) 
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Event date: 
25-Sep-2024 - 26-Sep-2024
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Event place: 
Austria
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Number of Pages: 
4
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Keywords: 
Accelerated testing; Reliability; LEDs; Wire bond interconnects; Lifetime
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Research Areas: 
Special and Engineering Materials: 40%
Materials Characterization: 40%
Modeling and Simulation: 20%
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Science Branch: 
1040 - Chemie: 30%
1030 - Physik, Astronomie: 40%
2020 - Elektrotechnik, Elektronik, Informationstechnik: 30%
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Appears in Collections:
Conference Paper

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