2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Book title Buchtitel
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Publisher Herausgeber
IEEE Xplore
Results 1-2 of 2 (Search time: 0.001 seconds).
| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Rovitto, M. ; Zisser, W. H. ; Ceric, H. ; Grasser, T. | Electromigration modelling of void nucleation in open Cu-TSVs | Konferenzbeitrag Inproceedings | 2015 | |
| 2 | Lederer, M. ; Lassnig, A. ; Khatibi, G. ; Delshadmanesh, M. | Reliability assessment of copper ball bonds by combination of simulation and accelerated mechanical testing | Konferenzbeitrag Inproceedings | 2015 |