2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Book title Buchtitel
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Editor Herausgeber_in
Publisher Herausgeber
IEEE- Explore
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| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Geokdeniz, Zeynep ; Khatibi, Golta ; Nicolics, Johann ; Steiger-Thirsfeld, Andreas ; IEEE | Behaviour of Silver-Sintered Joints by Cyclic Mechanical Loading and Influence of Temperature | Konferenzbeitrag Inproceedings | 2019 |