2009 International Conference on Simulation of Semiconductor Processes and Devices

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	Authors / Editors	Title	Type	Issue Date
1	Ertl, Otmar ; Selberherr, Siegfried	A Fast Void Detection Algorithm for Three-Dimensional Deposition Simulation	Konferenzbeitrag Inproceedings	2009
2	Goes, Wolfgang ; Grasser, Tibor ; Karner, Markus ; Kaczer, Ben	A Model for Switching Traps in Amorphous Oxides	Konferenzbeitrag Inproceedings	2009
3	Ceric, Hajdin ; de Orio, Roberto Lacerda ; Cervenka, Johann ; Selberherr, Siegfried	Copper Microstructure Impact on Evolution of Electromigration Induced Voids	Konferenzbeitrag Inproceedings	2009
4	Neophytou, Neophytos ; Kosina, Hans ; Selberherr, Siegfried ; Klimeck, Gerhard	Dependence of Injection Velocity and Capacitance of Si Nanowires on Diameter, Orientation, and Gate Bias: An Atomistic Tight-Binding Study	Konferenzbeitrag Inproceedings	2009
5	de Orio, Roberto Lacerda ; Ceric, Hajdin ; Cervenka, Johann ; Selberherr, Siegfried	The Effect of Copper Grain Size Statistics on the Electromigration Lifetime Distribution	Konferenzbeitrag Inproceedings	2009
6	Sverdlov, Viktor ; Baumgartner, Oskar ; Windbacher, Thomas ; Schanovsky, Franz ; Selberherr, Siegfried	Thickness Dependence of the Effective Masses in a Strained Thin Silicon Film	Konferenzbeitrag Inproceedings	2009