Proceedings of the European Microelectronics and Packaging Conference EMPC

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Proceedings of the European Microelectronics and Packaging Conference EMPC
 

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PreviewAuthor(s)TitleTypeIssue Date
1Vanek, J. ; Smetana, Walter ; Weilguni, Michael ; Szendiuch, I. Characterization of PTC resistor pastes applied in LTCC technologyKonferenzbeitrag Inproceedings2009
2Mazloum Nejadari, Ali ; Lederer, Martin ; Khatibi, Golta ; Nicolics, Johann Crystal plasticity modeling of the heat affected zone of copper micro-wiresKonferenzbeitrag Inproceedings2017
3Silvano de Sousa, Jonathan ; Unger, Michael ; Fulmek, Paul L. ; Haumer, P. ; Nicolics, Johann Embedded Mini Heat Pipes asThermal Solution for PCBsKonferenzbeitrag Inproceedings2017