Proceedings of the IEEE International Reliability Physics Symposium
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Proceedings of the IEEE International Reliability Physics Symposium
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Preview | Authors / Editors | Title | Type | Issue Date | |
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1 | Huang, R ; Robl, W. ; Detzel, T. ; Ceric, Hajdin | Modeling of Stress Evolution of Electroplated Cu Films during Self-annealing | Konferenzbeitrag Inproceedings | 2010 |