2013 IEEE International Integrated Reliability Workshop Final Report

Book title Buchtitel
2013 IEEE International Integrated Reliability Workshop Final Report
 

Publications Publikationen

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PreviewAuthor(s)TitleTypeIssue Date
1Ceric, H. ; Singulani, A. Pires ; de Orio, R. L. ; Selberherr, S. Electromigration enhanced growth of intermetallic compound in solder bumpsKonferenzbeitrag Inproceedings2013
2Zisser, W. H. ; Ceric, H. ; de Orio, R. L. ; Selberherr, S. Electromigration induced stress in open TSVsKonferenzbeitrag Inproceedings2013