2013 IEEE International Integrated Reliability Workshop Final Report
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2013 IEEE International Integrated Reliability Workshop Final Report
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| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Ceric, H. ; Singulani, A. Pires ; de Orio, R. L. ; Selberherr, S. | Electromigration enhanced growth of intermetallic compound in solder bumps | Konferenzbeitrag Inproceedings | 2013 | |
| 2 | Zisser, W. H. ; Ceric, H. ; de Orio, R. L. ; Selberherr, S. | Electromigration induced stress in open TSVs | Konferenzbeitrag Inproceedings | 2013 |