IEEE International Interconnect Technology Conference
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IEEE International Interconnect Technology Conference
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| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Ceric, H. ; Selberherr, S. | Electromigration induced failure of solder bumps and the role of IMC | Konferenzbeitrag Inproceedings  | 2014 |