Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Filipovic, Lado ; de Orio, Roberto Lacerda ; Selberherr, Siegfried | Effects of sidewall scallops on the performance and reliability of filled copper and open tungsten TSVs | Konferenzbeitrag Inproceedings | 2014 | |
| 2 | Zisser, Wolfhard H. ; Ceric, Hajdin ; Weinbub, Josef ; Selberherr, Siegfried | Electromigration reliability of open TSV structures | Konferenzbeitrag Inproceedings | 2014 | |
| 3 | Ceric, Hajdin ; Selberherr, Siegfried | Electromigration reliability of solder bumps | Konferenzbeitrag Inproceedings | 2014 |