Proceedings of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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Proceedings of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Rovitto, Marco ; Zisser, Wolfhard ; Ceric, Hajdin | Analysis of Electromigration Void Nucleation Failure Time in Open Copper TSVs | Konferenzbeitrag Inproceedings | 2015 | |
| 2 | Papaleo, Santo ; Zisser, Wolfhard ; Ceric, Hajdin | Effects of the Initial Stress at the Bottom of Open TSVs | Konferenzbeitrag Inproceedings | 2015 |