Proceedings of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Book title Buchtitel
Proceedings of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
 

Publications Publikationen



Results 1-2 of 2 (Search time: 0.002 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Rovitto, Marco ; Zisser, Wolfhard ; Ceric, Hajdin Analysis of Electromigration Void Nucleation Failure Time in Open Copper TSVsKonferenzbeitrag Inproceedings2015
2Papaleo, Santo ; Zisser, Wolfhard ; Ceric, Hajdin Effects of the Initial Stress at the Bottom of Open TSVsKonferenzbeitrag Inproceedings2015