2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Filipovic, Lado ; Selberherr, Siegfried | Effects of the Deposition Process Variation on the Performance of Open TSVs | Konferenzbeitrag Inproceedings  | 2016 | |
| 2 | Rovitto, Marco ; Ceric, Hajdin | Electromigration Induced Voiding and Resistance Change in Three-Dimensional Copper through Silicon Vias | Konferenzbeitrag Inproceedings | 2016 | |
| 3 | Papaleo, Santo ; Rovitto, Marco ; Ceric, Hajdin | Mechanical Effects of the Volmer-Weber Growth in the TSV Sidewall | Konferenzbeitrag Inproceedings | 2016 |