2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

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	Author(s)	Title	Type	Issue Date
1	Filipovic, Lado ; Selberherr, Siegfried	Effects of the Deposition Process Variation on the Performance of Open TSVs	Konferenzbeitrag Inproceedings	2016
2	Rovitto, Marco ; Ceric, Hajdin	Electromigration Induced Voiding and Resistance Change in Three-Dimensional Copper through Silicon Vias	Konferenzbeitrag Inproceedings	2016
3	Papaleo, Santo ; Rovitto, Marco ; Ceric, Hajdin	Mechanical Effects of the Volmer-Weber Growth in the TSV Sidewall	Konferenzbeitrag Inproceedings	2016