Abstracts of the International Conference Reliability and Stress-Related Phenomena in Nanoelectronics - Experiment and Simulation (IRSP)
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Abstracts of the International Conference Reliability and Stress-Related Phenomena in Nanoelectronics - Experiment and Simulation (IRSP)
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Preview | Authors / Editors | Title | Type | Issue Date | |
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1 | Ceric, Hajdin ; Orio, Roberto ; Rovitto, Marco | TCAD Approach for the Assessment of Interconnect Reliability | Konferenzbeitrag Inproceedings | 2016 |