2022 IEEE International Interconnect Technology Conference (IITC)

Book title Buchtitel

Results 1-2 of 2 (Search time: 0.002 seconds).

RIS EndNote Bibtex Send via email

		Preview	Author(s)	Title	Type	Issue Date
	1		Saleh, A. S. ; Zahedmanesh, H. ; Ceric, H. ; Croes, K. ; De Wolf, I.	Dynamics of Electromigration Voids in Cu Interconnects: Investigation Using a Physics-Based Model Augmented by Neural Networks	Konferenzbeitrag Inproceedings	2022
	2		Ceric, H. ; de Orio, R. L. ; Selberherr, S.	Electromigration Degradation of Gold Interconnects: A Statistical Study	Konferenzbeitrag Inproceedings	2022