2022 IEEE International Interconnect Technology Conference (IITC)

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		Preview	Authors / Editors	Title	Type	Issue Date
	1		Saleh, A. S. ; Zahedmanesh, H. ; Ceric, H. ; Croes, K. ; De Wolf, I.	Dynamics of Electromigration Voids in Cu Interconnects: Investigation Using a Physics-Based Model Augmented by Neural Networks	Konferenzbeitrag Inproceedings	2022
	2		Ceric, H. ; de Orio, R. L. ; Selberherr, S.	Electromigration Degradation of Gold Interconnects: A Statistical Study	Konferenzbeitrag Inproceedings	2022