6th European Advanced Technology Workshop on Micropackaging and Thermal Management

Book title Buchtitel
6th European Advanced Technology Workshop on Micropackaging and Thermal Management
 

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PreviewAuthor(s)TitleTypeIssue Date
1Haas, T. ; Zeilmann, C. ; Backes, Andreas ; Schmid, Ulrich ; Bittner, Achim Investigation of Innovative Cooling Concepts for Functional Ceramic CircuitsKonferenzbeitrag Inproceedings2011