17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016

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Description

Event name
17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016
 
Start date
18-04-2016
End date
20-04-2016
 
Location
Deutschland
Country
Europe
 
Event format Veranstaltungsformat
On Site

Publications Publikationen

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PreviewAuthor(s)TitleTypeIssue Date
1Mazloum Nejadari, Ali ; Khatibi, Golta ; Lederer, Martin ; Czerny, Bernhard ; Nicolics, Johann ; Weiss, Laurenz Reliability analysis of Cu wire bonds in microelectronic packagesKonferenzbeitrag Inproceedings2016