EMPC, 22nd Microelectronics an Packaging Conference (EMPC) & Exhibition
Event name
EMPC, 22nd Microelectronics an Packaging Conference (EMPC) & Exhibition
Start date
16-09-2019
End date
19-09-2019
Location
Pisa, Italy
Country
Event format Veranstaltungsformat
On Site
Results 1-1 of 1 (Search time: 0.001 seconds).
| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Geokdeniz, Zeynep ; Khatibi, Golta ; Nicolics, Johann ; Steiger-Thirsfeld, Andreas ; IEEE | Behaviour of Silver-Sintered Joints by Cyclic Mechanical Loading and Influence of Temperature | Konferenzbeitrag Inproceedings | 2019 |