European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF)

Event name
European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF)
 
Event type
Event for scientific audience
 
Start date
23-09-2019
End date
26-09-2019
 
Location
Maastricht
Country
Netherlands
 
Event format Veranstaltungsformat
On Site

Publications Publikationen

Filter:
Author:  Selberherr, Siegfried

Results 1-9 of 9 (Search time: 0.002 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Zisser, Wolfhard ; Ceric, Hajdin ; Weinbub, Josef ; Selberherr, Siegfried Electromigration Reliability of Open TSV StructuresKonferenzbeitrag Inproceedings2014
2Ayalew, Tesfaye ; Gehring, Andreas ; Grasser, Tibor ; Selberherr, Siegfried Enhancement of Breakdown Voltage for Ni-SiC Schottky Diodes Utilizing Field Plate Edge TerminationPräsentation Presentation2004
3Ayalew, Tesfaye ; Gehring, Andreas ; Park, Jong Mun ; Grasser, Tibor ; Selberherr, Siegfried Improving SiC Lateral DMOSFET Reliability under High Field StressPräsentation Presentation2003
4Filipovic, Lado ; Singulani, Anderson P. ; Roger, Frederic ; Carniello, Sara ; Selberherr, Siegfried Intrinsic Stress Analysis of Tungsten-Lined Open TSVsKonferenzbeitrag Inproceedings2015
5Gehring, Andreas ; Jimenez-Molinos, F. ; Kosina, Hans ; Palma, A. ; Gamiz, Francisco ; Selberherr, Siegfried Modeling of Retention Time Degradation Due to Inelastic Trap-Assisted Tunneling in EEPROM DevicesPräsentation Presentation2003
6Ceric, Hajdin ; Selberherr, Siegfried Simulative Prediction of the Resistance Change due to Electromigration Induced Void EvolutionPräsentation Presentation2002
7Gehring, Andreas ; Selberherr, Siegfried Statistical Simulation of Gate Dielectric Wearout, Leakage, and BreakdownPräsentation Presentation2004
8Singulani, Anderson P. ; Ceric, Hajdin ; Selberherr, Siegfried Stress Evolution in the Metal Layers of TSVs with Bosch ScallopsPräsentation Presentation2013
9Filipovic, Lado ; Selberherr, Siegfried The Effects of Etching and Deposition on the Performance and Stress Evolution of Open Through Silicon ViasKonferenzbeitrag Inproceedings 2014