International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Event name
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Start date
14-04-2013
End date
17-04-2013
Location
Poland
Country
Event format Veranstaltungsformat
On Site
Results 1-1 of 1 (Search time: 0.001 seconds).
| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Singulani, A. P. ; Ceric, H. ; Filipovic, L. ; Langer, E. | Impact of bosch scallops dimensions on stress of an open through Silicon Via technology | Konferenzbeitrag Inproceedings | 2013 |