International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Event name
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
 
Start date
14-04-2013
End date
17-04-2013
 
Location
Poland
Country
 
Event format Veranstaltungsformat
On Site

Publications Publikationen



Results 1-1 of 1 (Search time: 0.005 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Singulani, A. P. ; Ceric, H. ; Filipovic, L. ; Langer, E. Impact of bosch scallops dimensions on stress of an open through Silicon Via technologyKonferenzbeitrag Inproceedings2013