EuroSimE 2013 14th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Event name
EuroSimE 2013 14th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Start date
15-04-2013
End date
17-04-2013
Location
Wroclaw, Poland
Country
Event format Veranstaltungsformat
On Site
Results 1-1 of 1 (Search time: 0.001 seconds).
| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Lederer, M. ; Czerny, B. ; Nagl, Bernhard ; Trnka, A. ; Khatibi, G. ; Thoben, M. | Simulation of stress concentrations in wire-bonds using a novel strain gradient theory | Konferenzbeitrag Inproceedings | 2013 |