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Record link: 
http://hdl.handle.net/20.500.12708/73841
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Title: 
Simulation of stress concentrations in wire-bonds using a novel strain gradient theory
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Citation: 
Lederer, M., Czerny, B., Nagl, B., Trnka, A., Khatibi, G., & Thoben, M. (2013). Simulation of stress concentrations in wire-bonds using a novel strain gradient theory. In Conference Proceedings (pp. 1–6). http://hdl.handle.net/20.500.12708/73841
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Publication Type: 
Inproceedings - Poster Contribution
en
Authors: 
Lederer, M. 
Czerny, B. 
Nagl, Bernhard 
Trnka, A. 
Khatibi, G. 
Thoben, M. 
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Organisational Unit: 
E366-02 - Forschungsbereich Mikrosystemtechnik 
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Published in: 
Conference Proceedings 
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Date (published): 
2013
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Event name: 
EuroSimE 2013 14th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems 
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Event date: 
15-Apr-2013 - 17-Apr-2013
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Event place: 
Wroclaw, Poland, EU
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Number of Pages: 
6
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Peer reviewed: 
No
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Research Areas: 
Materials Characterization: 35%
Special and Engineering Materials: 40%
Sensor Systems: 25%
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Science Branch: 
Elektrotechnik, Elektronik
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Appears in Collections:
Conference Paper

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