International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Event name
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Start date
07-04-2014
End date
09-04-2014
Location
Ghent, Belgium
Country
Event format Veranstaltungsformat
On Site
Results 1-2 of 2 (Search time: 0.001 seconds).
| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Rovitto, M. ; Zisser, W. H. ; Ceric, H. ; Grasser, T. | Electromigration modelling of void nucleation in open Cu-TSVs | Konferenzbeitrag Inproceedings | 2015 | |
| 2 | Filipovic, Lado ; de Orio, Roberto Lacerda ; Selberherr, Siegfried | Process and reliability of SF<inf>6</inf>/O<inf>2</inf> plasma etched copper TSVs | Konferenzbeitrag Inproceedings | 2014 |