IEEE Electronic Components and Technology Conference (ECTC)
Event name
IEEE Electronic Components and Technology Conference (ECTC)
Start date
31-05-2016
End date
03-06-2016
Location
Las Vegas, NV, USA
Country
Event format Veranstaltungsformat
On Site
Results 1-3 of 3 (Search time: 0.001 seconds).
| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Filipovic, Lado ; Selberherr, Siegfried | Effects of the Deposition Process Variation on the Performance of Open TSVs | Konferenzbeitrag Inproceedings  | 2016 | |
| 2 | Rovitto, Marco ; Ceric, Hajdin | Electromigration Induced Voiding and Resistance Change in Three-Dimensional Copper through Silicon Vias | Konferenzbeitrag Inproceedings | 2016 | |
| 3 | Papaleo, Santo ; Rovitto, Marco ; Ceric, Hajdin | Mechanical Effects of the Volmer-Weber Growth in the TSV Sidewall | Konferenzbeitrag Inproceedings | 2016 |