International Conference Reliability and Stress-Related Phenomena in Nanoelectronics - Experiment and Simulation (IRSP)
Event name
International Conference Reliability and Stress-Related Phenomena in Nanoelectronics - Experiment and Simulation (IRSP)
Start date
30-05-2016
End date
01-06-2016
Location
Bad Schandau, Germany
Country
Event format Veranstaltungsformat
On Site
Results 1-1 of 1 (Search time: 0.001 seconds).
| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Ceric, Hajdin ; Orio, Roberto ; Rovitto, Marco | TCAD Approach for the Assessment of Interconnect Reliability | Konferenzbeitrag Inproceedings | 2016 |