17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2016)

Event name
17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2016)
 
Start date
17-04-2016
End date
20-04-2016
 
Location
Montpellier, France
Country
Europe
 
Event format Veranstaltungsformat
On Site

Publications Publikationen



Treffer 1-1 von 1 (Suchzeit: 0.001 Sekunden).

VorschauAutor_in(nen)TitelDokumenttypErscheinungs­datum
1Suhir, Ephraim ; Nicolics, Johann Power Core (PC) Embedding a Plurality of IC Devices and Sandwiched Between Two Dissimilar Insulated Metal Substrates (IMS'): Predicted Thermal StressesKonferenzbeitrag Inproceedings2016