17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2016)
Event name
17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2016)
Start date
17-04-2016
End date
20-04-2016
Location
Montpellier, France
Country
Event format Veranstaltungsformat
On Site
Results 1-1 of 1 (Search time: 0.002 seconds).
| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Suhir, Ephraim ; Nicolics, Johann | Power Core (PC) Embedding a Plurality of IC Devices and Sandwiched Between Two Dissimilar Insulated Metal Substrates (IMS'): Predicted Thermal Stresses | Konferenzbeitrag Inproceedings | 2016 |