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| | Preview | Authors / Editors | Title | Type | Issue Date |
| 1 | | Suhir, Ephraim ; Paul, Gunther ; Kaindl, Hermann | Towards Probabilistic Analysis of Human-System Integration in Automated Driving | Konferenzbeitrag Inproceedings | 2020 |
| 2 | | Suhir, E. ; Ghaffarian, R. ; Yi, S. ; Nicolics, J. | Assessed interfacial strength and elastic moduli of the bonding material from shear-off test data | Artikel Article | 2017 |
| 3 | | Suhir, E. ; Ghaffarian, R. ; Nicolics, J. | Predicted stresses in ball-grid-array (BGA) and column-grid-array (CGA) interconnections in a mirror-like package design | Artikel Article | 2016 |
| 4 | | Suhir, E. ; Ghaffarian, R. ; Nicolics, J. | Could thermal stresses in a BGA/CGA-system be evaluated from a model intended for a homogeneously bonded assembly? | Artikel Article | 2016 |
| 5 | | Suhir, Ephraim ; Ghaffarian, R. ; Nicolics, Johann | Expected stress relief in a bi-material inhomogeneously bonded assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at the ends | Artikel Article | 2016 |
| 6 | | Suhir, E. ; Nicolics, J. | Power Core (PC) Embedding a Plurality of IC Devices and Sandwiched Between Two Dissimilar Insulated Metal Substrates (IMS'): Predicted Thermal Stresses | Artikel Article | 2016 |
| 7 | | Suhir, Ephraim ; Nicolics, Johann | Power Core (PC) Embedding a Plurality of IC Devices and Sandwiched Between Two Dissimilar Insulated Metal Substrates (IMS'): Predicted Thermal Stresses | Konferenzbeitrag Inproceedings | 2016 |
| 8 | | Suhir, E. ; Nicolics, J. ; Khatibi, G. ; Lederer, M. | Semiconductor Film Grown on a Circular Substrate: Predictive Modeling of Lattice-Misfit Stresses | Konferenzbeitrag Inproceedings | 2016 |
| 9 | | Khatibi, Golta ; Czerny, Bernhard ; Lassnig, Alice ; Lederer, Martin ; Magnien, Julien ; Nicolics, Johann ; Suhir, Ephraim | A novel approach for evaluation of material interfaces in electronics | Konferenzbeitrag Inproceedings | 2016 |
| 10 | | Suhir, E. ; Yi, S. ; Nicolics, J. ; Khatibi, G. ; Lederer, M. | Semiconductor film grown on a circular substrate: predictive modeling of lattice-misfit stresses | Artikel Article | 2016 |
| 11 | | Suhir, Ephraim ; Bensoussan, Alain ; Nicolics, Johann | Bow-Free Tri-Component Mechanically Pre-Stressed Failure-Oriented-Accelerated-Test (FOAT) Specimen | Konferenzbeitrag Inproceedings | 2015 |
| 12 | | Suhir, Ephraim ; Bechou, Laurent ; Nicolics, Johann | Bow-free tri-component assembly for aerospace optoelectronics applications: Predicted thermal stresses | Konferenzbeitrag Inproceedings | 2015 |
| 13 | | Suhir, Ephraim ; Ghaffarian, Reza ; Nicolics, Johann | Could application of column-grid-array (CGA) technology result in inelastic-strain-free state-of-stress in solder material? | Artikel Article | 2015 |
| 14 | | Suhir, E. | Three-step concept (TSC) in modeling microelectronics reliability (MR): Boltzmann-Arrhenius-Zhurkov (BAZ) probabilistic physics-of-failure equation sandwiched between two statistical models | Artikel Article | 2015 |
| 15 | | Suhir, Ephraim | Analysis of a short beam with application to solder joints: could larger stand-off heights relieve stress? | Artikel Article | 2015 |
| 16 | | Suhir, Ephraim ; Bensoussan, Alain ; Nicolics, Johann | Predicted Device-Degradation Failure-Rate | Artikel Article | 2015 |
| 17 | | Suhir, E. ; Bensoussan, A. ; Khatibi, G. ; Nicolics, J. | Probabilistic design for reliability in electronics and photonics: Role, significance, attributes, challenges | Konferenzbeitrag Inproceedings | 2015 |
| 18 | | Suhir, Ephraim ; Bensoussan, Alain ; Khatibi, G. ; Nicolics, Johann | Probabilistic Design for Reliability in Electronics and Photonics: Role, Significance, Attributes, Challenges | Konferenzbeitrag Inproceedings | 2014 |
| 19 | | Khatibi, Golta ; Czerny, Bernhard ; Magnien, Julien ; Lederer, Martin ; Suhir, Ephraim ; Nicolics, Johann | Towards Adequate Qualification Testing of Electronic Products: Review and Extension | Konferenzbeitrag Inproceedings | 2014 |
