Name Card

Full name Familienname, Vorname
Suhir, Ephraim
 
Main Affiliation Organisations­zuordnung
 

Own Publications Eigene Publikationen

Results 1-19 of 19 (Search time: 0.001 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Suhir, Ephraim ; Paul, Gunther ; Kaindl, Hermann Towards Probabilistic Analysis of Human-System Integration in Automated DrivingKonferenzbeitrag Inproceedings2020
2Suhir, E. ; Ghaffarian, R. ; Yi, S. ; Nicolics, J. Assessed interfacial strength and elastic moduli of the bonding material from shear-off test dataArtikel Article 2017
3Suhir, Ephraim ; Nicolics, Johann Power Core (PC) Embedding a Plurality of IC Devices and Sandwiched Between Two Dissimilar Insulated Metal Substrates (IMS'): Predicted Thermal StressesKonferenzbeitrag Inproceedings2016
4Khatibi, Golta ; Czerny, Bernhard ; Lassnig, Alice ; Lederer, Martin ; Magnien, Julien ; Nicolics, Johann ; Suhir, Ephraim A novel approach for evaluation of material interfaces in electronicsKonferenzbeitrag Inproceedings2016
5Suhir, E. ; Nicolics, J. ; Khatibi, G. ; Lederer, M. Semiconductor Film Grown on a Circular Substrate: Predictive Modeling of Lattice-Misfit StressesKonferenzbeitrag Inproceedings2016
6Suhir, E. ; Yi, S. ; Nicolics, J. ; Khatibi, G. ; Lederer, M. Semiconductor film grown on a circular substrate: predictive modeling of lattice-misfit stressesArtikel Article 2016
7Suhir, E. ; Ghaffarian, R. ; Nicolics, J. Could thermal stresses in a BGA/CGA-system be evaluated from a model intended for a homogeneously bonded assembly?Artikel Article 2016
8Suhir, E. ; Ghaffarian, R. ; Nicolics, J. Predicted stresses in ball-grid-array (BGA) and column-grid-array (CGA) interconnections in a mirror-like package designArtikel Article 2016
9Suhir, E. ; Nicolics, J. Power Core (PC) Embedding a Plurality of IC Devices and Sandwiched Between Two Dissimilar Insulated Metal Substrates (IMS'): Predicted Thermal StressesArtikel Article 2016
10Suhir, Ephraim ; Ghaffarian, R. ; Nicolics, Johann Expected stress relief in a bi-material inhomogeneously bonded assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at the endsArtikel Article 2016
11Suhir, Ephraim ; Bensoussan, Alain ; Nicolics, Johann Bow-Free Tri-Component Mechanically Pre-Stressed Failure-Oriented-Accelerated-Test (FOAT) SpecimenKonferenzbeitrag Inproceedings2015
12Suhir, Ephraim ; Bechou, Laurent ; Nicolics, Johann Bow-free tri-component assembly for aerospace optoelectronics applications: Predicted thermal stressesKonferenzbeitrag Inproceedings2015
13Suhir, E. ; Bensoussan, A. ; Khatibi, G. ; Nicolics, J. Probabilistic design for reliability in electronics and photonics: Role, significance, attributes, challengesKonferenzbeitrag Inproceedings2015
14Suhir, Ephraim ; Bensoussan, Alain ; Nicolics, Johann Predicted Device-Degradation Failure-RateArtikel Article2015
15Suhir, E. Three-step concept (TSC) in modeling microelectronics reliability (MR): Boltzmann-Arrhenius-Zhurkov (BAZ) probabilistic physics-of-failure equation sandwiched between two statistical modelsArtikel Article2015
16Suhir, Ephraim ; Ghaffarian, Reza ; Nicolics, Johann Could application of column-grid-array (CGA) technology result in inelastic-strain-free state-of-stress in solder material?Artikel Article2015
17Suhir, Ephraim Analysis of a short beam with application to solder joints: could larger stand-off heights relieve stress?Artikel Article2015
18Suhir, Ephraim ; Bensoussan, Alain ; Khatibi, G. ; Nicolics, Johann Probabilistic Design for Reliability in Electronics and Photonics: Role, Significance, Attributes, ChallengesKonferenzbeitrag Inproceedings2014
19Khatibi, Golta ; Czerny, Bernhard ; Magnien, Julien ; Lederer, Martin ; Suhir, Ephraim ; Nicolics, Johann Towards Adequate Qualification Testing of Electronic Products: Review and ExtensionKonferenzbeitrag Inproceedings2014