The 2017 European Microelectronics and Packaging Conference (EMPC)
Event name
The 2017 European Microelectronics and Packaging Conference (EMPC)
Event type
Event for scientific audience
Start date
10-09-2017
End date
13-09-2017
Location
Poland
Country
Event format Veranstaltungsformat
On Site
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| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Sedlmair, Josef ; Khatibi, Golta ; Czerny, Bernhard | BAMFIT - Accelerated Lifetime Tests for Heavy Wire Bonds | Präsentation Presentation | 2017 |