2009 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

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Description

Event name
2009 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
 
Event type
Event for scientific audience
 
Start date
09-09-2009
End date
11-09-2009
 
Location
San Diego, CA
Country
United States
 
Event format Veranstaltungsformat
On Site

Publications Publikationen

Results 1-6 of 6 (Search time: 0.001 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Ceric, Hajdin ; de Orio, Roberto Lacerda ; Cervenka, Johann ; Selberherr, Siegfried Copper Microstructure Impact on Evolution of Electromigration Induced VoidsKonferenzbeitrag Inproceedings2009
2Neophytou, Neophytos ; Kosina, Hans ; Selberherr, Siegfried ; Klimeck, Gerhard Dependence of Injection Velocity and Capacitance of Si Nanowires on Diameter, Orientation, and Gate Bias: An Atomistic Tight-Binding StudyKonferenzbeitrag Inproceedings2009
3de Orio, Roberto Lacerda ; Ceric, Hajdin ; Cervenka, Johann ; Selberherr, Siegfried The Effect of Copper Grain Size Statistics on the Electromigration Lifetime DistributionKonferenzbeitrag Inproceedings2009
4Ertl, Otmar ; Selberherr, Siegfried A Fast Void Detection Algorithm for Three-Dimensional Deposition SimulationKonferenzbeitrag Inproceedings2009
5Goes, Wolfgang ; Grasser, Tibor ; Karner, Markus ; Kaczer, Ben A Model for Switching Traps in Amorphous OxidesKonferenzbeitrag Inproceedings2009
6Sverdlov, Viktor ; Baumgartner, Oskar ; Windbacher, Thomas ; Schanovsky, Franz ; Selberherr, Siegfried Thickness Dependence of the Effective Masses in a Strained Thin Silicon FilmKonferenzbeitrag Inproceedings2009