2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

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Description

Event name
2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
 
Event type
Event for scientific audience
 
Start date
04-09-2019
End date
06-09-2019
 
Location
Udine
Country
Italy
 
Event format Veranstaltungsformat
On Site

Publications Publikationen

Results 1-5 of 5 (Search time: 0.002 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Fiorentini, Simone ; Orio, Roberto ; Goes, Wolfgang ; Ender, Johannes ; Sverdlov, Viktor Comprehensive Comparison of Switching Models for Perpendicular Spin-Transfer Torque MRAM CellsKonferenzbeitrag Inproceedings2019
2Filipovic, Lado Modeling and Simulation of Atomic Layer DepositionKonferenzbeitrag Inproceedings2019
3Toifl, Alexander ; Quell, Michael ; Hössinger, Andreas ; Babayan, Artem ; Selberherr, Siegfried ; Weinbub, Josef Novel Numerical Dissipation Scheme for Level-Set Based Anisotropic Etching SimulationsKonferenzbeitrag Inproceedings2019
4Quell, Michael ; Toifl, Alexander ; Hössinger, Andreas ; Selberherr, Siegfried ; Weinbub, Josef Parallelized Level-Set Velocity Extension Algorithm for Nanopatterning ApplicationsKonferenzbeitrag Inproceedings2019
5Klemenschits, Xaver ; Manstetten, Paul ; Filipovic, Lado ; Selberherr, Siegfried Process Simulation in the Browser: Porting ViennaTS using WebAssemblyKonferenzbeitrag Inproceedings2019