Name Card

Full name Familienname, Vorname
Rovitto, Marco
 
Main Affiliation Organisations­zuordnung
 

Own Publications Eigene Publikationen

Results 1-8 of 8 (Search time: 0.003 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Papaleo, Santo ; Rovitto, Marco ; Ceric, Hajdin Mechanical Effects of the Volmer-Weber Growth in the TSV SidewallKonferenzbeitrag Inproceedings 2016
2Rovitto, Marco ; Ceric, Hajdin Electromigration Induced Voiding and Resistance Change in Three-Dimensional Copper through Silicon ViasKonferenzbeitrag Inproceedings 2016
3Ceric, Hajdin ; Orio, Roberto ; Rovitto, Marco TCAD Approach for the Assessment of Interconnect ReliabilityKonferenzbeitrag Inproceedings2016
4Rovitto Marco - 2016 - Electromigration reliability issue in interconnects for...pdf.jpgRovitto, Marco Electromigration reliability issue in interconnects for three-dimensional integration technologiesThesis Hochschulschrift 2016
5Rovitto, M. ; Zisser, W. H. ; Ceric, H. ; Grasser, T. Electromigration modelling of void nucleation in open Cu-TSVsKonferenzbeitrag Inproceedings2015
6Rovitto, Marco ; Zisser, Wolfhard ; Ceric, Hajdin Analysis of Electromigration Void Nucleation Failure Time in Open Copper TSVsKonferenzbeitrag Inproceedings2015
7Ceric, H. ; Rovitto, M. Impact of microstructure and current crowding on electromigration: A TCAD studyKonferenzbeitrag Inproceedings2015
8Ceric, H. ; Zisser, W. H. ; Rovitto, M. ; Selberherr, S. Electromigration in solder bumps: A mean-time-to-failure TCAD studyKonferenzbeitrag Inproceedings2014