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| | Preview | Authors / Editors | Title | Type | Issue Date |
| 1 | | Kirchlechner, C. ; Toth, F. ; Rammerstorfer, F.G. ; Fischer, F.D. ; Dehm, G. | Pre- and Post-Buckling Behavior of Bi-Crystalline Micropillars: Origin and Consequences | Artikel Article | 2017 |
| 2 | | Toth, F. ; Kirchlechner, C. ; Fischer, F.D. ; Dehm, G. ; Rammerstorfer, F.G. | Compressed Bi-Crystal Micropillars Showing a Sigmoidal Deformation State - A Computational Study | Artikel Article | 2017 |
| 3 | | Hahn, R. ; Bartosik, M. ; Soler, R. ; Kirchlechner, C. ; Dehm, G. ; Mayrhofer, P.H. | Superlattice effect for enhanced fracture toughness of hard coatings | Artikel Article | 2016 |
| 4 | | Wimmer, A. ; Smolka, Martin ; Heinz, W. ; Detzel, T. ; Robl, W. ; Motz, C. ; Eyert, V. ; Wimmer, E. ; Jahnel, F. ; Treichler, R. ; Dehm, G. | Temperature dependent transition of intragranular plastic to intergranular brittle failure in electrodeposited Cu micro-tensile samples | Artikel Article | 2014 |
| 5 | | Daum, B. ; Dehm, G. ; Clemens, H. ; Rester, M. ; Fischer, F.D. ; Rammerstorfer, F.G. | Elastoplastic Buckling as Source of Misinterpretation of Micropillar Tests | Artikel Article | 2013 |
| 6 | | Preis, Wolfgang ; Hou, J ; Sitte, Werner ; Zhang, Z ; Dehm, G. ; Frömling, Till ; Hutter, Herbert ; Fleig, Jürgen | Transport properties and structure of interfaces in-type barium titanate ceramics | Konferenzbeitrag Inproceedings | 2011 |
| 7 | | Huang, R ; Robl, W. ; Dehm, G. ; Ceric, Hajdin ; Detzel, T. | Disparate Tendency of Stress Evolution of Thin and Thick Electroplated Cu Films at Room Temperature | Konferenzbeitrag Inproceedings | 2010 |
| 8 | | Cordill, M. J. ; Taylor, A. ; Schalko, Johannes ; Dehm, G. | Fracture and Delamination of Chromium Thin Films on Polymer Substrates | Artikel Article | 2010 |
| 9 | | Cordill, M.J. ; Fischer, F.D. ; Rammerstorfer, F.G. ; Dehm, G. | Adhesion Energies of Cr Thin Films on Polyimide Determined from Buckling: Experiment and Model; | Artikel Article | 2010 |
| 10 | | Huang, R ; Robl, W. ; Ceric, Hajdin ; Detzel, T. ; Dehm, G. | Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing | Artikel Article | 2010 |
