Name Card

Full name Familienname, Vorname
Dehm, G.
 

Own Publications Eigene Publikationen

Results 1-10 of 10 (Search time: 0.001 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Toth, F. ; Kirchlechner, C. ; Fischer, F.D. ; Dehm, G. ; Rammerstorfer, F.G. Compressed Bi-Crystal Micropillars Showing a Sigmoidal Deformation State - A Computational StudyArtikel Article 2017
2Kirchlechner, C. ; Toth, F. ; Rammerstorfer, F.G. ; Fischer, F.D. ; Dehm, G. Pre- and Post-Buckling Behavior of Bi-Crystalline Micropillars: Origin and ConsequencesArtikel Article 2017
3Hahn, R. ; Bartosik, M. ; Soler, R. ; Kirchlechner, C. ; Dehm, G. ; Mayrhofer, P.H. Superlattice effect for enhanced fracture toughness of hard coatingsArtikel Article 2016
4Wimmer, A. ; Smolka, Martin ; Heinz, W. ; Detzel, T. ; Robl, W. ; Motz, C. ; Eyert, V. ; Wimmer, E. ; Jahnel, F. ; Treichler, R. ; Dehm, G. Temperature dependent transition of intragranular plastic to intergranular brittle failure in electrodeposited Cu micro-tensile samplesArtikel Article2014
5Daum, B. ; Dehm, G. ; Clemens, H. ; Rester, M. ; Fischer, F.D. ; Rammerstorfer, F.G. Elastoplastic Buckling as Source of Misinterpretation of Micropillar TestsArtikel Article2013
6Preis, Wolfgang ; Hou, J ; Sitte, Werner ; Zhang, Z ; Dehm, G. ; Frömling, Till ; Hutter, Herbert ; Fleig, Jürgen Transport properties and structure of interfaces in-type barium titanate ceramicsKonferenzbeitrag Inproceedings2011
7Huang, R ; Robl, W. ; Dehm, G. ; Ceric, Hajdin ; Detzel, T. Disparate Tendency of Stress Evolution of Thin and Thick Electroplated Cu Films at Room TemperatureKonferenzbeitrag Inproceedings2010
8Cordill, M. J. ; Taylor, A. ; Schalko, Johannes ; Dehm, G. Fracture and Delamination of Chromium Thin Films on Polymer SubstratesArtikel Article2010
9Cordill, M.J. ; Fischer, F.D. ; Rammerstorfer, F.G. ; Dehm, G. Adhesion Energies of Cr Thin Films on Polyimide Determined from Buckling: Experiment and Model;Artikel Article2010
10Huang, R ; Robl, W. ; Ceric, Hajdin ; Detzel, T. ; Dehm, G. Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-AnnealingArtikel Article 2010