Record link: 
http://hdl.handle.net/20.500.12708/166827
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Title: 
Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing
en
Citation: 
Huang, R., Robl, W., Ceric, H., Detzel, T., & Dehm, G. (2010). Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing. IEEE Transactions on Device and Materials Reliability, 10(1), 47–54. https://doi.org/10.1109/tdmr.2009.2032768
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Publisher DOI: 
10.1109/tdmr.2009.2032768
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Publication Type: 
Artikel - Original Research Article
de
 
Article - Original Research Article
en
Language: 
English
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Authors: 
Huang, R 
Robl, W. 
Ceric, Hajdin 
Detzel, T. 
Dehm, G. 
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Organisational Unit: 
E360 - Institut für Mikroelektronik 
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Journal: 
IEEE Transactions on Device and Materials Reliability 
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ISSN: 
1530-4388
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Date (published): 
2010
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Number of Pages: 
8
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Publisher: 
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
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Peer reviewed: 
Yes
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Keywords: 
Electrical and Electronic Engineering; Electronic, Optical and Magnetic Materials; Safety, Risk, Reliability and Quality
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Research Areas: 
Modelling and Simulation: 100%
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Science Branch: 
Elektrotechnik, Elektronik
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