<div class="csl-bib-body">
<div class="csl-entry">Huang, R., Robl, W., Ceric, H., Detzel, T., & Dehm, G. (2010). Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing. <i>IEEE Transactions on Device and Materials Reliability</i>, <i>10</i>(1), 47–54. https://doi.org/10.1109/tdmr.2009.2032768</div>
</div>
-
dc.identifier.issn
1530-4388
-
dc.identifier.uri
http://hdl.handle.net/20.500.12708/166827
-
dc.language.iso
en
-
dc.publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
-
dc.relation.ispartof
IEEE Transactions on Device and Materials Reliability
-
dc.subject
Electrical and Electronic Engineering
-
dc.subject
Electronic, Optical and Magnetic Materials
-
dc.subject
Safety, Risk, Reliability and Quality
-
dc.title
Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing
en
dc.type
Artikel
de
dc.type
Article
en
dc.description.startpage
47
-
dc.description.endpage
54
-
dc.type.category
Original Research Article
-
tuw.container.volume
10
-
tuw.container.issue
1
-
tuw.journal.peerreviewed
true
-
tuw.peerreviewed
true
-
tuw.researchTopic.id
C6
-
tuw.researchTopic.name
Modelling and Simulation
-
tuw.researchTopic.value
100
-
dcterms.isPartOf.title
IEEE Transactions on Device and Materials Reliability
