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Record link: 
http://hdl.handle.net/20.500.12708/72887
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Title: 
Disparate Tendency of Stress Evolution of Thin and Thick Electroplated Cu Films at Room Temperature
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Citation: 
Huang, R., Robl, W., Dehm, G., Ceric, H., & Detzel, T. (2010). Disparate Tendency of Stress Evolution of Thin and Thick Electroplated Cu Films at Room Temperature. In Proceedings of the 17#^{th} International Symposium on the Physical & Failure Analysis of Integrated Circuits (pp. 1–6). http://hdl.handle.net/20.500.12708/72887
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Publication Type: 
Inproceedings - Poster Contribution
en
Authors: 
Huang, R 
Robl, W. 
Dehm, G. 
Ceric, Hajdin 
Detzel, T. 
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Organisational Unit: 
E360 - Institut für Mikroelektronik 
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Published in: 
Proceedings of the 17#^{th} International Symposium on the Physical & Failure Analysis of Integrated Circuits 
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Date (published): 
2010
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Event name: 
IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 
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Event date: 
27-Jun-2005 - 1-Jul-2005
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Event place: 
Singapore, Non-EU
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Number of Pages: 
6
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Peer reviewed: 
No
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Science Branch: 
Elektrotechnik, Elektronik
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Appears in Collections:
Conference Paper

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