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| | Preview | Author(s) | Title | Type | Issue Date |
| 1 | | Gös, Wolfgang ; Karner, Markus ; Sverdlov, Viktor ; Grasser, Tibor | A Rigorous Model for Trapping and Detrapping in Thin Gate Dielectrics | Konferenzbeitrag Inproceedings | 2008 |
| 2 | | Rovitto, Marco ; Zisser, Wolfhard ; Ceric, Hajdin | Analysis of Electromigration Void Nucleation Failure Time in Open Copper TSVs | Konferenzbeitrag Inproceedings | 2015 |
| 3 | | Ceric, H. ; de Orio, R. L. ; Selberherr, S. | Analysis of solder bump electromigration reliability | Konferenzbeitrag Inproceedings | 2013 |
| 4 | | Starkov, Ivan ; Tyaginov, S. E. ; Triebl, Oliver ; Cervenka, Johann ; Jungemann, C. ; Carniello, Sara ; Park, Jong Mun ; Enichlmair, H. ; Karner, Markus ; Kernstock, Christian ; Seebacher, E. ; Minixhofer, R. ; Ceric, Hajdin ; Grasser, Tibor | Analysis of Worst-Case Hot-Carrier Conditions for High Voltage Transistors Based on Full-Band Monte-Carlo Simulations | Konferenzbeitrag Inproceedings | 2010 |
| 5 | | Starkov, I. ; Enichlmair, H. ; Tyaginov, S. ; Grasser, T. | Charge-pumping extraction techniques for hot-carrier induced interface and oxide trap spatial distributions in MOSFETs | Konferenzbeitrag Inproceedings | 2012 |
| 6 | | Ceric, Hajdin ; Deshpande, V ; Hollauer, Christian ; Holzer, Stefan ; Grasser, Tibor ; Selberherr, Siegfried | Comprehensive Analysis of Vacancy Dynamics Due to Electromigration | Konferenzbeitrag Inproceedings | 2005 |
| 7 | | Huang, R ; Robl, W. ; Dehm, G. ; Ceric, Hajdin ; Detzel, T. | Disparate Tendency of Stress Evolution of Thin and Thick Electroplated Cu Films at Room Temperature | Konferenzbeitrag Inproceedings | 2010 |
| 8 | | Filipovic, Lado ; de Orio, Roberto Lacerda ; Selberherr, Siegfried | Effects of sidewall scallops on the performance and reliability of filled copper and open tungsten TSVs | Konferenzbeitrag Inproceedings | 2014 |
| 9 | | Papaleo, Santo ; Zisser, Wolfhard ; Ceric, Hajdin | Effects of the Initial Stress at the Bottom of Open TSVs | Konferenzbeitrag Inproceedings | 2015 |
| 10 | | Ceric, Hajdin ; Orio, Roberto ; Selberherr, Siegfried | Electromigration Anisotropy and Mechanical Stress in Modern Copper Interconnect | Konferenzbeitrag Inproceedings | 2010 |
| 11 | | Zisser, Wolfhard H. ; Ceric, Hajdin ; Weinbub, Josef ; Selberherr, Siegfried | Electromigration reliability of open TSV structures | Konferenzbeitrag Inproceedings | 2014 |
| 12 | | Ceric, Hajdin ; Selberherr, Siegfried | Electromigration reliability of solder bumps | Konferenzbeitrag Inproceedings | 2014 |
| 13 | | Grasser, Tibor ; Rott, K. ; Reisinger, H. ; Waltl, Michael ; Gös, Wolfgang | Evidence for Defect Pairs in SiON pMOSFETs | Konferenzbeitrag Inproceedings | 2014 |
| 14 | | Tyaginov, S. E. ; Starkov, Ivan ; Triebl, Oliver ; Cervenka, Johann ; Jungemann, C. ; Carniello, Sara ; Park, Jong Mun ; Enichlmair, H. ; Karner, Markus ; Kernstock, Christian ; Seebacher, E. ; Minixhofer, R. ; Ceric, Hajdin ; Grasser, Tibor | Hot-Carrier Degradation Modeling Using Full-Band Monte-Carlo Simulations | Konferenzbeitrag Inproceedings | 2010 |
| 15 | | Tyaginov, S. E. ; Starkov, I. A. ; Triebl, O. ; Karner, M. ; Kernstock, Ch. ; Jungemann, C. ; Enichlmair, H. ; Park, J.M. ; Grasser, T. | Impact of gate oxide thickness variations on hot-carrier degradation | Konferenzbeitrag Inproceedings | 2012 |
| 16 | | Wittmann, Robert ; Puchner, H ; Ceric, Hajdin ; Selberherr, Siegfried | Impact of Random Bit Values on NBTI Lifetime of an SRAM Cell | Konferenzbeitrag Inproceedings | 2006 |
| 17 | | Ceric, H. ; de Orio, R. L. ; Selberherr, S. | Integration of atomistic and continuum-level electromigration models | Konferenzbeitrag Inproceedings | 2011 |
| 18 | | Wagner, Paul-Jürgen ; Grasser, Tibor ; Reisinger, H. ; Kaczer, Ben | Oxide Traps in MOS Transistors: Semi-Automatic Extraction of Trap Parameters from Time Dependent Defect Spectroscopy | Konferenzbeitrag Inproceedings | 2010 |
| 19 | | Illarionov, Yu. Yu. ; Grasser, T. | Reliability of 2D Field-Effect Transistors: from First Prototypes to Scalable Devices | Konferenzbeitrag Inproceedings | 2019 |
| 20 | | Ceric, Hajdin ; Hollauer, Christian ; Selberherr, Siegfried | Simulation of Texture Development Caused Stress Build-Up in Electroplated Copper Lines | Konferenzbeitrag Inproceedings | 2006 |
