Statistics: 2005 International Conference On Simulation of Semiconductor Processes and Devices

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Region	#
EU - Europe	1166
AS - Asia, other	63
NA - North America	16
Total	1245

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Country	#
AT - Austria	1148
SG - Singapore	61
US - United States of America	15
DE - Germany	11
FI - Finland	5
CN - China	2
FR - France	2
MX - Mexico	1
Total	1245

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City	#
Vienna	334
Helsinki	5
Singapore	4
Santa Clara	3
Los Angeles	2
Shanghai	2
Aix-en-Provence	1
Mexico City	1
Unknown	893
Total	1245

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Most viewed items	#
ID: 72378 - Applications of Three-Dimensional Topography Simulation in the Design of Interconnect Lines	117
Total	117

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Year	Jan	Feb	Mar	Apr	May	Jun	Jul	Aug	Sep	Oct	Nov	Dec	Tot
2022	0	0	0	0	0	0	0	286	298	143	11	22	760
2023	55	11	44	22	11	66	0	24	15	69	24	18	359
2024	12	80	13	21	0	0	0	0	0	0	0	0	126
Ever													1245