<div class="csl-bib-body">
<div class="csl-entry">Ivashko, O., Horio, M., Wan, W., Christensen, N. B., McNally, D. E., Paris, E., Tseng, Y., Shaik, N. E., Ronnow, H. M., Wei, H. I., Adamo, C., Lichtensteiger, C., Gilbert, M., Beasley, M. R., Shen, K. M., Tomczak, J. M., Schmitt, T., & Chang, J. (2019). Strain-engineering Mott-insulating La₂CuO₄. <i>Nature Communications</i>, <i>10</i>, Article 786. https://doi.org/10.1038/s41467-019-08664-6</div>
</div>
-
dc.identifier.issn
2041-1723
-
dc.identifier.uri
http://hdl.handle.net/20.500.12708/143658
-
dc.description.abstract
The transition temperature Tc of unconventional superconductivity is often tunable. For a monolayer of FeSe, for example, the sweet spot is uniquely bound to titanium-oxide substrates. By contrast for La₂₋ₓSrₓCuO₄ thin films, such substrates are sub-optimal and the highest Tc is instead obtained using LaSrAlO₄. An outstanding challenge is thus to understand the optimal conditions for superconductivity in thin films: which microscopic parameters drive the change in Tc and how can we tune them? Here we demonstrate, by a combination of x-ray absorption and resonant inelastic x-ray scattering spectroscopy, how the Coulomb and magnetic-exchange interaction of La₂CuO₄ thin films can be enhanced by compressive strain. Our experiments and theoretical calculations establish that the substrate producing the largest Tc under doping also generates the largest nearest neighbour hopping integral, Coulomb and magnetic-exchange interaction. We hence suggest optimising the parent Mott state as a strategy for enhancing the superconducting transition temperature in cuprates.
en
dc.language.iso
en
-
dc.relation.ispartof
Nature Communications
-
dc.subject
General Physics and Astronomy
en
dc.subject
General Chemistry
en
dc.subject
Multidisciplinary
en
dc.subject
General Biochemistry
en
dc.subject
Genetics
en
dc.subject
Molecular Biology
en
dc.title
Strain-engineering Mott-insulating La₂CuO₄
en
dc.type
Artikel
de
dc.type
Article
en
dc.contributor.affiliation
University of Zurich, Switzerland
-
dc.contributor.affiliation
University of Zurich, Switzerland
-
dc.contributor.affiliation
Technical University of Denmark, Denmark
-
dc.contributor.affiliation
Technical University of Denmark, Denmark
-
dc.contributor.affiliation
Paul Scherrer Institute, Switzerland
-
dc.contributor.affiliation
Paul Scherrer Institute, Switzerland
-
dc.contributor.affiliation
Paul Scherrer Institute, Switzerland
-
dc.contributor.affiliation
École Polytechnique Fédérale de Lausanne, Switzerland
-
dc.contributor.affiliation
École Polytechnique Fédérale de Lausanne, Switzerland
-
dc.contributor.affiliation
Cornell University, United States of America (the)
-
dc.contributor.affiliation
Stanford University, United States of America (the)
-
dc.contributor.affiliation
University of Geneva, Switzerland
-
dc.contributor.affiliation
University of Zurich, Switzerland
-
dc.contributor.affiliation
Stanford University, United States of America (the)
-
dc.contributor.affiliation
Cornell University, United States of America (the)