Toggle navigation
reposiTUm
ABOUT REPOSITUM
HELP
Login
News
Browse by
Publication Types
Organizations
Researchers
Projects
TU Wien Academic Press
Open Access Series
Theses
Digitised Works
Year of Publication
DC Field
Value
Language
dc.contributor.author
Czerny, Bernhard
-
dc.contributor.author
Khatibi Damavandi, Golta
-
dc.date.accessioned
2023-01-31T12:30:52Z
-
dc.date.available
2023-01-31T12:30:52Z
-
dc.date.issued
2022
-
dc.identifier.citation
<div class="csl-bib-body"> <div class="csl-entry">Czerny, B., & Khatibi Damavandi, G. (2022). Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics. <i>Journal of Microelectronics and Electronic Packaging</i>, <i>19</i>, 49–55. https://doi.org/10.4071/imaps.1717134</div> </div>
-
dc.identifier.issn
1551-4897
-
dc.identifier.uri
http://hdl.handle.net/20.500.12708/144361
-
dc.language.iso
en
-
dc.publisher
IMAPS
-
dc.relation.ispartof
Journal of Microelectronics and Electronic Packaging
-
dc.subject
power module reliability
en
dc.subject
power cycling
en
dc.subject
shear test
en
dc.subject
thermomechanical fatigue
en
dc.subject
wire bond interconnects
en
dc.subject
Accelerated Testing
en
dc.subject
BAMFIT
en
dc.subject
wire bond lift-off
en
dc.subject
CTE mismatch
en
dc.title
Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics
en
dc.type
Article
en
dc.type
Artikel
de
dc.contributor.affiliation
University of Applied Sciences Burgenland, Pinkafeld, Austria
-
dc.description.startpage
49
-
dc.description.endpage
55
-
dcterms.dateSubmitted
2022-03-07
-
dc.type.category
Original Research Article
-
tuw.container.volume
19
-
tuw.journal.peerreviewed
true
-
tuw.peerreviewed
true
-
tuw.researchTopic.id
M1
-
tuw.researchTopic.id
E2
-
tuw.researchTopic.id
C6
-
tuw.researchTopic.name
Surfaces and Interfaces
-
tuw.researchTopic.name
Sustainable and Low Emission Mobility
-
tuw.researchTopic.name
Modeling and Simulation
-
tuw.researchTopic.value
50
-
tuw.researchTopic.value
20
-
tuw.researchTopic.value
30
-
dcterms.isPartOf.title
Journal of Microelectronics and Electronic Packaging
-
tuw.publication.orgunit
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit
-
tuw.publisher.doi
10.4071/imaps.1717134
-
dc.identifier.eissn
1555-8037
-
dc.description.numberOfPages
7
-
tuw.author.orcid
0000-0001-8147-3122
-
wb.sciencebranch
Chemie
-
wb.sciencebranch
Elektrotechnik, Elektronik, Informationstechnik
-
wb.sciencebranch.oefos
1040
-
wb.sciencebranch.oefos
2020
-
wb.sciencebranch.value
50
-
wb.sciencebranch.value
50
-
item.openairetype
Article
-
item.openairetype
Artikel
-
item.grantfulltext
restricted
-
item.cerifentitytype
Publications
-
item.cerifentitytype
Publications
-
item.languageiso639-1
en
-
item.openairecristype
http://purl.org/coar/resource_type/c_18cf
-
item.openairecristype
http://purl.org/coar/resource_type/c_18cf
-
item.fulltext
no Fulltext
-
crisitem.author.dept
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit
-
crisitem.author.dept
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit
-
crisitem.author.orcid
0000-0001-8147-3122
-
crisitem.author.parentorg
E164-03 - Forschungsbereich Chemische Technologien
-
crisitem.author.parentorg
E164-03 - Forschungsbereich Chemische Technologien
-
Appears in Collections:
Article
Show simple item record
Items in reposiTUm are protected by copyright, with all rights reserved, unless otherwise indicated.
Page view(s)
22
checked on May 1, 2023
Download(s)
1
checked on May 1, 2023
Google Scholar
TM
Check