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Record link: 
http://hdl.handle.net/20.500.12708/149963
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Title: 
Sn-Ag-Cu nanosolders: Solder joints integrity and strength
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Citation: 
Roshanghias, A., Khatibi, G., Yakymovych, A., Bernardi, J., & Ipser, H. (2016). Sn-Ag-Cu nanosolders: Solder joints integrity and strength. Journal of Electronic Materials, 45(8), 4390–4399. https://doi.org/10.1007/s11664-016-4584-4
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Publisher DOI: 
10.1007/s11664-016-4584-4
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Publication Type: 
Article - Original Research Article
en
Authors: 
Roshanghias, Ali 
Khatibi, Golta 
Yakymovych, Andriy 
Bernardi, Johannes 
Ipser, Herbert 
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Organisational Unit: 
E057-02 - Fachbereich Universitäre Serviceeinrichtung für Transmissions- Elektronenmikroskopie 
E164 - Institut für Chemische Technologien und Analytik 
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Journal: 
Journal of Electronic Materials 
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ISSN: 
0361-5235
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Date (published): 
2016
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Number of Pages: 
10
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Peer reviewed: 
Yes
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Keywords: 
Electrical and Electronic Engineering; Condensed Matter Physics; Electronic, Optical and Magnetic Materials; Materials Chemistry
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Research Areas: 
Surfaces and Interfaces: 30%
Materials Characterization: 40%
Structure-Property Relationship: 30%
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Science Branch: 
Chemie
Metallurgie
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Appears in Collections:
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