Towards a multi-abrasive grinding model for the material point method

Abstract

An efficient optimization of surface finishing processes can save high amounts of energy and resources. Because of the large occurring deformations, grinding processes are notoriously difficult to model using standard (mesh-based) microscale modeling techniques. In this work, we use the meshless material point method to study the influence of abrasive shape, orientation, rake angle, and infeed depth on the grinding result. We discuss the chip morphology, the surface topography, cutting versus plowing mode, the material removal rate, and the chip temperature. A generalization of our model from a straightforward single-abrasive approach to a multiple-abrasive simulation with pseudo-periodical boundary conditions greatly increases the degree of realism and lays the foundation for comparison with real finishing processes. We finally compare our results for multiple abrasives to those obtained for a scaled-down molecular dynamics system and discuss similarities and differences.